RB

Ravi K. Bonam

IBM: 19 patents #5,782 of 70,183Top 9%
SF SUNY Research Foundation: 1 patents #469 of 1,165Top 45%
📍 Albany, NY: #82 of 790 inventorsTop 15%
🗺 New York: #6,964 of 115,490 inventorsTop 7%
Overall (All Time): #217,114 of 4,157,543Top 6%
20
Patents All Time

Issued Patents All Time

Showing 1–20 of 20 patents

Patent #TitleCo-InventorsDate
12086528 Secure fingerprinting of a trusted photomask Scott D. Halle, Gauri Karve, Effendi Leobandung, Gangadhara Raja Muthinti 2024-09-10
11887908 Electronic package structure with offset stacked chips and top and bottom side cooling lid Kamal K. Sikka, Katsuyuki Sakuma, Hilton T. Toy, Shidong Li 2024-01-30
11791270 Direct bonded heterogeneous integration silicon bridge Kamal K. Sikka, Maryse Cournoyer, Pascale Gagnon, Charles C. Bureau, Catherine Dufort +8 more 2023-10-17
11619877 Determination of optical roughness in EUV structures Gangadhara Raja Muthinti 2023-04-04
11480868 Determination of optical roughness in EUV structures Gangadhara Raja Muthinti 2022-10-25
11462512 Three-dimensional microelectronic package with embedded cooling channels Kamal K. Sikka, Fee Li Lie, Kevin R. Winstel, Iqbal Rashid Saraf, Dario L. Goldfarb +2 more 2022-10-04
11239167 Cu—Cu bonding for interconnects on bridge chip attached to chips and packaging substrate Mukta G. Farooq, James J. Kelly, Spyridon Skordas 2022-02-01
11081424 Micro-fluidic channels having various critical dimensions Kamal K. Sikka, Joshua M. Rubin, Iqbal Rashid Saraf, Fee Li Lie 2021-08-03
11049844 Semiconductor wafer having trenches with varied dimensions for multi-chip modules Mukta G. Farooq, Dinesh Gupta, James J. Kelly, Kamal K. Sikka, Joshua M. Rubin 2021-06-29
10991635 Multiple chip bridge connector Dale Curtis McHerron, Kamal K. Sikka, Joshua M. Rubin, Ramachandra Divakaruni, William J. Starke +1 more 2021-04-27
10943883 Planar wafer level fan-out of multi-chip modules having different size chips Mukta G. Farooq, Dinesh Gupta, James J. Kelly 2021-03-09
10937764 Three-dimensional microelectronic package with embedded cooling channels Kamal K. Sikka, Fee Li Lie, Kevin R. Winstel, Iqbal Rashid Saraf, Dario L. Goldfarb +2 more 2021-03-02
10725454 Mask process aware calibration using mask pattern fidelity inspections Nicole Saulnier, Michael M. Crouse, Derren N. Dunn 2020-07-28
10437951 Care area generation by detection optimized methodology Nelson Felix, Scott D. Halle, Luciana Meli 2019-10-08
10141188 Resist having tuned interface hardmask layer for EUV exposure Michael P. Belyansky, Anuja E. DeSilva, Scott D. Halle 2018-11-27
10134592 Resist having tuned interface hardmask layer for EUV exposure Michael P. Belyansky, Anuja E. DeSilva, Scott D. Halle 2018-11-20
9929012 Resist having tuned interface hardmask layer for EUV exposure Michael P. Belyansky, Anuja E. DeSilva, Scott D. Halle 2018-03-27
9881762 Integrated photoemission sources and scalable photoemission structures 2018-01-30
9263228 Integrated photoemission sources and scalable photoemission structures 2016-02-16
9177817 Methods for fabricating three-dimensional nano-scale structures and devices John G. Hartley 2015-11-03