Issued Patents All Time
Showing 1–25 of 73 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12327278 | Remote based online product selection | Sarbajit K. Rakshit, Chandrasekhar Narayanaswami | 2025-06-10 |
| 12300615 | Infrared debond damage mitigation by copper fill pattern | Mukta G. Farooq, Qianwen Chen, Shahid Butt, Eric D. Perfecto, Michael P. Belyansky +1 more | 2025-05-13 |
| 12290384 | Two-layer adhesion of electronics to a surface | Leanna Pancoast | 2025-05-06 |
| 12277595 | Dynamic virtual reality shopping shelf interface | Sarbajit K. Rakshit | 2025-04-15 |
| 12199059 | Sintering a nanoparticle paste for semiconductor chip join | Mukta G. Farooq | 2025-01-14 |
| 12153912 | Upgrading operating software (“OS”) for devices in a multi-device ecosystem | Sarbajit K. Rakshit | 2024-11-26 |
| 12147091 | Piezoelectric device powering smart contact lens with eyelid movement | Sarbajit K. Rakshit | 2024-11-19 |
| 12043482 | Cognitive rotatable item storage with automated replenishment | Sarbajit K. Rakshit, Chandrasekhar Narayanaswami | 2024-07-23 |
| 12015003 | High density interconnection and wiring layers, package structures, and integration methods | John U. Knickerbocker, Mukta G. Farooq | 2024-06-18 |
| 11973058 | Multiple die assembly | Mukta G. Farooq, John U. Knickerbocker | 2024-04-30 |
| 11903734 | Wearable multiplatform sensor | Rajeev Narayanan, John U. Knickerbocker, Bucknell C. Webb | 2024-02-20 |
| 11887956 | Temperature hierarchy solder bonding | Mukta G. Farooq | 2024-01-30 |
| 11887908 | Electronic package structure with offset stacked chips and top and bottom side cooling lid | Kamal K. Sikka, Hilton T. Toy, Shidong Li, Ravi K. Bonam | 2024-01-30 |
| 11850068 | Modular sensing unit | Rajeev Narayanan, Bing Dang | 2023-12-26 |
| 11824037 | Assembly of a chip to a substrate | Mukta G. Farooq, Paul S. Andry, Russell Kastberg | 2023-11-21 |
| 11817394 | Semiconductor circuit power delivery | Mukta G. Farooq | 2023-11-14 |
| 11784160 | Asymmetric die bonding | Krishna R. Tunga, Shidong Li, Griselda Bonilla | 2023-10-10 |
| 11631650 | Solder transfer integrated circuit packaging | — | 2023-04-18 |
| 11545444 | Mitigating cooldown peeling stress during chip package assembly | Mukta G. Farooq, Krishna R. Tunga, Hilton T. Toy | 2023-01-03 |
| 11527462 | Circuit substrate with mixed pitch wiring | Shidong Li, Kamal K. Sikka | 2022-12-13 |
| 11471105 | Two-layer adhesion of electronics to a surface | Leanna Pancoast | 2022-10-18 |
| 11404379 | Structure and method for bridge chip assembly with capillary underfill | Mukta G. Farooq | 2022-08-02 |
| 11392188 | Maintaining smart contact lens power levels | Sarbajit K. Rakshit | 2022-07-19 |
| 11295982 | Forming ultra-thin chips for flexible electronics applications | Huan Hu, Xiao Hu Liu | 2022-04-05 |
| 11268867 | Strain gauge structure for a sensor | John U. Knickerbocker, Minhua Lu | 2022-03-08 |