Issued Patents All Time
Showing 26–50 of 73 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11246496 | Heart rate and blood pressure monitoring biosensors | Paolo Di Achille, Viatcheslav Gurev, John J. Rice | 2022-02-15 |
| 11197773 | Intraoral device control system | Stephen J. Heisig, Michael Angelo Stellitano | 2021-12-14 |
| 11172837 | Forming wearable stacked strain gauge sensor for monitoring | Jeffrey D. Gelorme, Marlon Agno | 2021-11-16 |
| 11116446 | Quantifying grip strength and characterizing movement idioms | Stephen J. Heisig | 2021-09-14 |
| 11121096 | Active control of electronic package warpage | Shidong Li | 2021-09-14 |
| 11094407 | Electronics miniaturization platform for medication verification and tracking | John U. Knickerbocker, Li-Wen Hung, Bing Dang, Jeffrey D. Gelorme, Rajeev Narayanan +1 more | 2021-08-17 |
| 11076246 | Eye-mounted hearing aid | Amos Cahan | 2021-07-27 |
| 11015913 | Flexible electronics for wearable healthcare sensors | Huan Hu, Ning Li, Xiao Hu Liu | 2021-05-25 |
| 10903187 | Selective area heating for 3D chip stack | Mario J. Interrante | 2021-01-26 |
| 10878231 | Writing recognition using wearable pressure sensing device | Stephen J. Heisig, John J. Rice, John U. Knickerbocker, Gaddi Blumrosen | 2020-12-29 |
| 10786202 | Quantifying grip strength and characterizing movement idioms | Stephen J. Heisig | 2020-09-29 |
| 10679931 | Ball grid array and land grid array assemblies fabricated using temporary resist | Jae-Woong Nah, Charles L. Reynolds | 2020-06-09 |
| 10433078 | Eye-mounted hearing aid | Amos Cahan | 2019-10-01 |
| 10419860 | Eye-mounted hearing aid | Amos Cahan | 2019-09-17 |
| 10359269 | Flexible electronics for wearable healthcare sensors | Huan Hu, Ning Li, Xiao Hu Liu | 2019-07-23 |
| 10280077 | Flexible electronics for wearable healthcare sensors | Paul S. Andry, Huan Hu | 2019-05-07 |
| 10262970 | Selective area heating for 3D chip stack | Mario J. Interrante | 2019-04-16 |
| 10249516 | Underfill dispensing using funnels | Evan G. Colgan, Michael A. Gaynes, Donald A. Merte | 2019-04-02 |
| 10249559 | Ball grid array and land grid array assemblies fabricated using temporary resist | Jae-Woong Nah, Charles L. Reynolds | 2019-04-02 |
| 10002835 | Structure for establishing interconnects in packages using thin interposers | Benjamin V. Fasano, Michael S. Cranmer, Richard F. Indyk, Harry D. Cox, Eric D. Perfecto | 2018-06-19 |
| 9875986 | Micro-scrub process for fluxless micro-bump bonding | Thomas Weiss | 2018-01-23 |
| 9875985 | Flip-chip bonder with induction coils and a heating element | Jae-Woong Nah, Sébastien S. Quesnel | 2018-01-23 |
| 9860996 | Selective area heating for 3D chip stack | Mario J. Interrante | 2018-01-02 |
| 9852960 | Underfill dispensing using funnels | Evan G. Colgan, Michael A. Gaynes, Donald A. Merte | 2017-12-26 |
| 9824925 | Flip chip alignment mark exposing method enabling wafer level underfill | Mukta G. Farooq, Kevin S. Petrarca, Nicholas A. Polomoff | 2017-11-21 |