Issued Patents All Time
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12204144 | Bragg reflector for photonic chip security structure | Yusheng Bian, Vibhor Jain | 2025-01-21 |
| 12130470 | PIC die and package with multiple level and multiple depth connections of fibers to on-chip optical components | Thomas Houghton, Yusheng Bian | 2024-10-29 |
| 11855005 | Crackstop with embedded passive radio frequency noise suppressor and method | Frank Kuechenmeister, Richard F. Taylor, III, Saquib B. Halim | 2023-12-26 |
| 11828983 | Photonics chips including cavities with non-right-angle internal corners | Ian Melville, Thomas Houghton, Koushik Ramachandran, Pallabi Das | 2023-11-28 |
| 11815717 | Photonic chip security structure | Vibhor Jain, Yusheng Bian | 2023-11-14 |
| 11804452 | Pic structure having barrier surrounding opening for optical element to prevent stress damage | Jae Kyu Cho, Mohamed Rabie, Yunyao Jiang, Koushik Ramachandran, Pallabi Das | 2023-10-31 |
| 11774689 | Photonics chips and semiconductor products having angled optical fibers | Bartlomiej Jan Pawlak | 2023-10-03 |
| 11740418 | Barrier structure with passage for waveguide in photonic integrated circuit | John J. Ellis-Monaghan, Frank Kuechenmeister, Jae Kyu Cho, Michal Rakowski | 2023-08-29 |
| 11719895 | Spot-size converters with angled facets | Yusheng Bian, Keith Donegan, Qizhi Liu, Steven M. Shank | 2023-08-08 |
| 11693048 | Cascaded sensing circuits for detecting and monitoring cracks in an integrated circuit | Dewei Xu, Eric D. Hunt-Schroeder | 2023-07-04 |
| 11650381 | PIC die and package with cover for multiple level and multiple depth connections of fibers to on-chip optical components | Yusheng Bian, Thomas Houghton | 2023-05-16 |
| 11569180 | Corner structures for an optical fiber groove and manufacturing methods thereof | Jae Kyu Cho, Mohamed Rabie, Andreas D. Stricker | 2023-01-31 |
| 11543606 | Photonics chips with an edge coupler and a continuous crackstop | Jae Kyu Cho, Frank Kuechenmeister, John J. Ellis-Monaghan, Michal Rakowski | 2023-01-03 |
| 11215661 | Cascaded sensing circuits for detecting and monitoring cracks in an integrated circuit | Dewei Xu, Eric D. Hunt-Schroeder | 2022-01-04 |
| 11145606 | Corner structures for an optical fiber groove | Jae Kyu Cho, Mohamed Rabie, Andreas D. Stricker | 2021-10-12 |
| 11105846 | Crack detecting and monitoring system for an integrated circuit | Dirk Breuer, Eric D. Hunt-Schroeder, Bernhard J. Wunder, Dewei Xu | 2021-08-31 |
| 11037873 | Hermetic barrier for semiconductor device | Igor Arsovski, Mark W. Kuemerle | 2021-06-15 |
| 10770407 | IC structure with interdigitated conductive elements between metal guard structures | Zhuojie Wu, Cathryn J. Christiansen, Erdem Kaltalioglu, Ping-Chuan Wang, Ronald G. Filippi +1 more | 2020-09-08 |
| 10770412 | Guard ring for photonic integrated circuit die | Andreas D. Stricker, Anupam ARORA | 2020-09-08 |
| 10714411 | Interconnected integrated circuit (IC) chip structure and packaging and method of forming same | Wolfgang Sauter, Mark W. Kuemerle, Eric W. Tremble, David B. Stone, Eric S. Parent +2 more | 2020-07-14 |
| 10546822 | Seal ring structure of integrated circuit and method of forming same | Vincent J. McGahay | 2020-01-28 |
| 10438902 | Arc-resistant crackstop | Vincent J. McGahay, Shaoning Yao, Anupam ARORA | 2019-10-08 |
| 10153232 | Crack stop with overlapping vias | Robert J. Fox, Kevin Boyd, Roderick A. Augur, Jeannine M. Trewhella | 2018-12-11 |
| 10109600 | Crackstop structures | Vincent J. McGahay | 2018-10-23 |
| 10090258 | Crack-stop structure for an IC product and methods of making such a crack-stop structure | Kevin Boyd, Robert J. Fox, Jeannine M. Trewhella, Roderick A. Augur | 2018-10-02 |