Issued Patents All Time
Showing 26–30 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10068859 | Crack trapping in semiconductor device structures | Mohamed Rabie, Victoria L. Calero Diaz Del Castillo, Danielle DeGraw, Michael Hecker | 2018-09-04 |
| 9824925 | Flip chip alignment mark exposing method enabling wafer level underfill | Mukta G. Farooq, Kevin S. Petrarca, Katsuyuki Sakuma | 2017-11-21 |
| 9754823 | Substrate including selectively formed barrier layer | Yuri M. Brovman, Brian M. Erwin, Jennifer D. Schuler, Matthew E. Souter, Christopher L. Tessler | 2017-09-05 |
| 9748135 | Substrate including selectively formed barrier layer | Yuri M. Brovman, Brian M. Erwin, Jennifer D. Schuler, Matthew E. Souter, Christopher L. Tessler | 2017-08-29 |
| 9343420 | Universal solder joints for 3D packaging | Brian M. Erwin, Eric D. Perfecto, Jae-Woong Nah | 2016-05-17 |