TH

Thomas Houghton

GU Globalfoundries U.S.: 7 patents #92 of 665Top 15%
IBM: 5 patents #18,733 of 70,183Top 30%
Globalfoundries: 2 patents #1,397 of 4,424Top 35%
AT AT&T: 1 patents #10,626 of 18,772Top 60%
📍 Marlboro, NY: #3 of 46 inventorsTop 7%
🗺 New York: #9,734 of 115,490 inventorsTop 9%
Overall (All Time): #310,487 of 4,157,543Top 8%
15
Patents All Time

Issued Patents All Time

Showing 1–15 of 15 patents

Patent #TitleCo-InventorsDate
12130470 PIC die and package with multiple level and multiple depth connections of fibers to on-chip optical components Nicholas A. Polomoff, Yusheng Bian 2024-10-29
11860414 Edge couplers including a grooved membrane Tymon Barwicz, Robert K. Leidy 2024-01-02
11828983 Photonics chips including cavities with non-right-angle internal corners Ian Melville, Nicholas A. Polomoff, Koushik Ramachandran, Pallabi Das 2023-11-28
11810870 Moisture seal for photonic devices Asli Sahin, Jennifer A. Oakley, Jeremy S. Alderman, Karen A. Nummy, Zhuojie Wu 2023-11-07
11650381 PIC die and package with cover for multiple level and multiple depth connections of fibers to on-chip optical components Nicholas A. Polomoff, Yusheng Bian 2023-05-16
11587888 Moisture seal for photonic devices Asli Sahin, Jennifer A. Oakley, Jeremy S. Alderman, Karen A. Nummy, Zhuojie Wu 2023-02-21
11487059 Photonics integrated circuit with silicon nitride waveguide edge coupler Asli Sahin, Karen A. Nummy, Kevin K. Dezfulian, Kenneth J. Giewont, Yusheng Bian 2022-11-01
10816726 Edge couplers for photonics applications Bo Peng, Yusheng Bian, Ajey Poovannummoottil Jacob, Asli Sahin 2020-10-27
9589895 Whole wafer edge seal Gregory Bazan 2017-03-07
8894800 Polymeric edge seal for bonded substrates Mutka G. Farooq, Nitin Parbhoo, Richard P. Volant 2014-11-25
8613996 Polymeric edge seal for bonded substrates Mukta G. Farooq, Nitin Parbhoo, Richard P. Volant 2013-12-24
7910484 Method for preventing backside defects in dielectric layers formed on semiconductor substrates Chester T. Dziobkowski, Emily R. Kinser, Darryl D. Restaino, Yun-Yu Wang 2011-03-22
7179760 Bilayer cap structure including HDP/bHDP films for conductive metallization and method of making same Richard A. Conti, Michael F. Lofaro, Jeffery B. Maxson, Ann McDonald, Yun-Yu Wang +2 more 2007-02-20
6009153 Electronic devices and programming methods therefor Edward Stanley Szurkowski, William P. Weber 1999-12-28
4721689 Method for simultaneously forming an interconnection level and via studs Paul N. Chaloux, Jr., Richard K. West 1988-01-26