Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12339494 | Edge couplers with a fine-alignment mechanism | Bartlomiej Jan Pawlak, Oscar D. Restrepo, Yusheng Bian, Eduardo Cruz Silva | 2025-06-24 |
| 12135456 | Waveguide cores with a dual-trapezoidal shape | Yusheng Bian, Karen A. Nummy | 2024-11-05 |
| 11828983 | Photonics chips including cavities with non-right-angle internal corners | Ian Melville, Nicholas A. Polomoff, Thomas Houghton, Pallabi Das | 2023-11-28 |
| 11804452 | Pic structure having barrier surrounding opening for optical element to prevent stress damage | Nicholas A. Polomoff, Jae Kyu Cho, Mohamed Rabie, Yunyao Jiang, Pallabi Das | 2023-10-31 |
| 11502400 | Microelectronics package with ultra-low-K dielectric region between stacked antenna elements | Selaka Bandara Bulumulla, Benjamin V. Fasano | 2022-11-15 |
| 11502106 | Multi-layered substrates of semiconductor devices | Benjamin V. Fasano, Ian Melville, Sarah H. Knickerbocker, Jorge A. Lubguban | 2022-11-15 |
| 11075453 | Microelectronics package with ultra-low-K dielectric region between stacked antenna elements | Selaka Bandara Bulumulla, Benjamin V. Fasano | 2021-07-27 |
| 10598860 | Photonic die fan out package with edge fiber coupling interface and related methods | Benjamin V. Fasano, Edmund Blackshear | 2020-03-24 |
| 10438894 | Chip-to-chip and chip-to-substrate interconnections in multi-chip semiconductor devices | Mukta G. Farooq, Eric D. Perfecto, Ian D. Melville | 2019-10-08 |
| 10409014 | PIC die packaging using magnetics to position optical element | Benjamin V. Fasano | 2019-09-10 |