Issued Patents All Time
Showing 1–25 of 82 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11536900 | Integrated circuit structure with optical absorber layer over optical grating coupler | Andreas D. Stricker, Hanyi Ding, Yusheng Bian, Bo Peng | 2022-12-27 |
| 11502400 | Microelectronics package with ultra-low-K dielectric region between stacked antenna elements | Selaka Bandara Bulumulla, Koushik Ramachandran | 2022-11-15 |
| 11502106 | Multi-layered substrates of semiconductor devices | Koushik Ramachandran, Ian Melville, Sarah H. Knickerbocker, Jorge A. Lubguban | 2022-11-15 |
| 11204463 | Integrated circuit structure with optical absorber layer over optical grating coupler | Andreas D. Stricker, Hanyi Ding, Yusheng Bian, Bo Peng | 2021-12-21 |
| 11146003 | Pluggable LGA socket for high density interconnects | Alan F. Benner, Paul F. Fortier, Hilton T. Toy | 2021-10-12 |
| 11075453 | Microelectronics package with ultra-low-K dielectric region between stacked antenna elements | Selaka Bandara Bulumulla, Koushik Ramachandran | 2021-07-27 |
| 10598860 | Photonic die fan out package with edge fiber coupling interface and related methods | Koushik Ramachandran, Edmund Blackshear | 2020-03-24 |
| 10460956 | Interposer with lattice construction and embedded conductive metal structures | Jean Audet, Shidong Li | 2019-10-29 |
| 10409014 | PIC die packaging using magnetics to position optical element | Koushik Ramachandran | 2019-09-10 |
| 10128590 | Pluggable LGA socket for high density interconnects | Alan F. Benner, Paul F. Fortier, Hilton T. Toy | 2018-11-13 |
| 10002835 | Structure for establishing interconnects in packages using thin interposers | Michael S. Cranmer, Richard F. Indyk, Harry D. Cox, Katsuyuki Sakuma, Eric D. Perfecto | 2018-06-19 |
| 9947204 | Validation of mechanical connections | Alan F. Benner | 2018-04-17 |
| 9673177 | Selectively soluble standoffs for chip joining | Mark W. Kapfhammer, David J. Lewison, Thomas E. Lombardi, Thomas Weiss | 2017-06-06 |
| 9673064 | Interposer with lattice construction and embedded conductive metal structures | Jean Audet, Shidong Li | 2017-06-06 |
| 9607973 | Method for establishing interconnects in packages using thin interposers | Michael S. Cranmer, Richard F. Indyk, Harry D. Cox, Katsuyuki Sakuma, Eric D. Perfecto | 2017-03-28 |
| 9577361 | Pluggable LGA socket for high density interconnects | Alan F. Benner, Paul F. Fortier, Hilton T. Toy | 2017-02-21 |
| 9443799 | Interposer with lattice construction and embedded conductive metal structures | Jean Audet, Shidong Li | 2016-09-13 |
| 9360644 | Laser die and photonics die package | Paul F. Fortier | 2016-06-07 |
| 9293439 | Electronic module assembly with patterned adhesive array | Edmund Blackshear, Elaine Cyr, Paul F. Fortier, Marcus E. Interrante, Roger Lam +4 more | 2016-03-22 |
| 9278401 | Fill head interface with combination vacuum pressure chamber | Glen N. Biggs, Russell A. Budd, John J. Garant, Peter A. Gruber, John P. Karidis +5 more | 2016-03-08 |
| 9093563 | Electronic module assembly with patterned adhesive array | Edmund Blackshear, Elaine Cyr, Paul F. Fortier, Marcus E. Interrante, Roger Lam +4 more | 2015-07-28 |
| 8981961 | Validation of mechanical connections | Alan F. Benner | 2015-03-17 |
| 8940550 | Maintaining laminate flatness using magnetic retention during chip joining | Shidong Li, Thomas Weiss | 2015-01-27 |
| 8559474 | Silicon carrier optoelectronic packaging | Paul S. Andry, Russell A. Budd, Bing Dang, David Danovitch, Paul F. Fortier +4 more | 2013-10-15 |
| 8290008 | Silicon carrier optoelectronic packaging | Paul S. Andry, Russell A. Budd, Bing Dang, David Danovitch, Paul F. Fortier +4 more | 2012-10-16 |