Issued Patents All Time
Showing 25 most recent of 121 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11541472 | Ultrasonic-assisted solder transfer | Jae-Woong Nah, Stephen L. Buchwalter, Paul A. Lauro, Da-Yuan Shih | 2023-01-03 |
| 11270966 | Combination polyimide decal with a rigid mold | Jae-Woong Nah, Stephen L. Buchwalter, Paul A. Lauro, Da-Yuan Shih | 2022-03-08 |
| 11110534 | Continuous solder transfer to substrates | Jae-Woong Nah, Stephen L. Buchwalter, Da-Yuan Shih, Paul A. Lauro | 2021-09-07 |
| 10658267 | Metal cored solder decal structure and process | Jae-Woong Nah | 2020-05-19 |
| 9972556 | Metal cored solder decal structure and process | Jae-Woong Nah | 2018-05-15 |
| 9679875 | Reduced volume interconnect for three-dimensional chip stack | Katsuyuki Sakuma, Da-Yuan Shih | 2017-06-13 |
| 9543273 | Reduced volume interconnect for three-dimensional chip stack | Katsuyuki Sakuma, Da-Yuan Shih | 2017-01-10 |
| 9295166 | Double solder bumps on substrates for low temperature flip chip bonding | Paul A. Lauro, Jae-Woong Nah | 2016-03-22 |
| 9278401 | Fill head interface with combination vacuum pressure chamber | Glen N. Biggs, Russell A. Budd, Benjamin V. Fasano, John J. Garant, John P. Karidis +5 more | 2016-03-08 |
| 9095081 | Double solder bumps on substrates for low temperature flip chip bonding | Paul A. Lauro, Jae-Woong Nah | 2015-07-28 |
| 9082754 | Metal cored solder decal structure and process | Jae-Woong Nah | 2015-07-14 |
| 8987132 | Double solder bumps on substrates for low temperature flip chip bonding | Paul A. Lauro, Jae-Woong Nah | 2015-03-24 |
| 8944306 | Forming metal preforms and metal balls | Paul A. Lauro, Jae-Woong Nah | 2015-02-03 |
| 8875978 | Forming constant diameter spherical metal balls | Claudius Feger, Mark H. McLeod, Jae-Woong Nah | 2014-11-04 |
| 8833636 | Forming an array of metal balls or shapes on a substrate | Paul A. Lauro, Jae-Woong Nah | 2014-09-16 |
| 8828860 | Double solder bumps on substrates for low temperature flip chip bonding | Paul A. Lauro, Jae-Woong Nah | 2014-09-09 |
| 8820616 | Method and apparatus providing fine alignment of a structure relative to a support | Philip Charles Danby Hobbs | 2014-09-02 |
| 8703274 | Microcavity structure and process | Russell A. Budd, Bing Dang, William Graham, Richard W. Levine, Da-Yuan Shih | 2014-04-22 |
| 8561880 | Forming metal preforms and metal balls | Paul A. Lauro, Jae-Woong Nah | 2013-10-22 |
| 8551816 | Direct edge connection for multi-chip integrated circuits | Steven A. Cordes, Matthew J. Farinelli, Sherif A. Goma, John U. Knickerbocker, James L. Speidell | 2013-10-08 |
| 8541299 | Electrical interconnect forming method | Stephen L. Buchwalter, Bruce K. Furman, Jae-Woong Nah, Da-Yuan Shih | 2013-09-24 |
| 8528805 | Method and apparatus providing fine alignment of a structure relative to a support | Philip Charles Danby Hobbs | 2013-09-10 |
| 8523046 | Forming an array of metal balls or shapes on a substrate | Paul A. Lauro, Jae-Woong Nah | 2013-09-03 |
| 8492262 | Direct IMS (injection molded solder) without a mask for forming solder bumps on substrates | Paul A. Lauro, Jae-Woong Nah | 2013-07-23 |
| 8476773 | Electrical interconnect structure | Stephen L. Buchwalter, Bruce K. Furman, Jae-Woong Nah, Da-Yuan Shih | 2013-07-02 |