Issued Patents All Time
Showing 51–75 of 121 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7867842 | Method and apparatus for forming planar alloy deposits on a substrate | Paul A. Lauro, Jae-Woong Nah | 2011-01-11 |
| 7857195 | Method and apparatus providing fine alignment of a structure relative to a support | Philip Charles Danby Hobbs | 2010-12-28 |
| 7841510 | Method and apparatus providing fine alignment of a structure relative to a support | Philip Charles Danby Hobbs | 2010-11-30 |
| 7838954 | Semiconductor structure with solder bumps | Stephen L. Buchwalter, Jae-Woong Nah, Da-Yuan Shih | 2010-11-23 |
| 7819376 | Techniques for forming interconnects | David Danovitch, Mukta G. Farooq, John U. Knickerbocker, George R. Proto, Da-Yuan Shih | 2010-10-26 |
| 7810702 | Solder standoffs for injection molding of solder | Steven A. Cordes | 2010-10-12 |
| 7784673 | Rotational fill techniques for injection molding of solder | Steven A. Cordes, John U. Knickerbocker, James L. Speidell | 2010-08-31 |
| 7786001 | Electrical interconnect structure and method | Stephen L. Buchwalter, Bruce K. Furman, Jae-Woong Nah, Da-Yuan Shih | 2010-08-31 |
| 7784664 | Fill head for injection molding of solder | Steven A. Cordes, John U. Knickerbocker, James L. Speidell | 2010-08-31 |
| 7751924 | C4NP servo controlled solder fill head | Timothy J. Chainer, Dennis G. Manzer | 2010-07-06 |
| 7713575 | Method and apparatus for depositing coplanar microelectronic interconnectors using a compliant mold | John U. Knickerbocker | 2010-05-11 |
| 7694869 | Universal mold for injection molding of solder | Steven A. Cordes, John U. Knickerbocker, James L. Speidell | 2010-04-13 |
| 7669748 | Conductive bonding material fill techniques | Steven A. Cordes, John U. Knickerbocker, James L. Speidell | 2010-03-02 |
| 7523852 | Solder interconnect structure and method using injection molded solder | Stephen L. Buchwalter, Claudius Feger, Sung Kwon Kang, Paul A. Lauro, Da-Yuan Shih | 2009-04-28 |
| 7516879 | Method of producing coaxial solder bump connections using injection molding of solder | Stephen L. Buchwalter, Steven A. Cordes | 2009-04-14 |
| 7506794 | High-temperature alloy standoffs for injection molding of solder | Steven A. Cordes | 2009-03-24 |
| 7497366 | Global vacuum injection molded solder system and method | S. Jay Chey, Steven A. Cordes, John U. Knickerbocker, James L. Speidell | 2009-03-03 |
| 7416104 | Rotational fill techniques for injection molding of solder | Steven A. Cordes, John U. Knickerbocker, James L. Speidell | 2008-08-26 |
| 7410090 | Conductive bonding material fill techniques | Steven A. Cordes, John U. Knickerbocker, James L. Speidell | 2008-08-12 |
| 7410092 | Fill head for injection molding of solder | Steven A. Cordes, John U. Knickerbocker, James L. Speidell | 2008-08-12 |
| 7401637 | Pressure-only molten metal valving apparatus and method | Glen N. Biggs, John J. Garant, Bouwe W. Leenstra, Christopher L. Tessler, Thomas Weiss | 2008-07-22 |
| 7348270 | Techniques for forming interconnects | David Danovitch, Mukta G. Farooq, John U. Knickerbocker, George R. Proto, Da-Yuan Shih | 2008-03-25 |
| 7332424 | Fluxless solder transfer and reflow process | Luc Belanger, Valerie Oberson, Christopher L. Tessler | 2008-02-19 |
| 7273806 | Forming of high aspect ratio conductive structure using injection molded solder | Robert A. Groves, Kevin S. Petrarca, Richard P. Volant, George F. Walker | 2007-09-25 |
| 7131565 | Feed devices and methods for injection molded solder systems | Lannie R. Bolde | 2006-11-07 |