Issued Patents All Time
Showing 101–121 of 121 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6133633 | Method for building interconnect structures by injection molded solder and structures built | Daniel G. Berger, Guy Paul Brouillette, David Danovitch, Rajesh Shankerlal Patel, Stephen Roux +2 more | 2000-10-17 |
| 6127735 | Interconnect for low temperature chip attachment | Daniel G. Berger, Guy Paul Brouillette, David Danovitch, Bruce Lee Humphrey, Michael Liehr +2 more | 2000-10-03 |
| 6105852 | Etched glass solder bump transfer for flip chip integrated circuit devices | Steven A. Cordes, Egon Max Kummer, Stephen Roux, Carlos J. Sambucetti, James L. Speidell | 2000-08-22 |
| 6056191 | Method and apparatus for forming solder bumps | Guy Paul Brouillette, Frederic Maurer | 2000-05-02 |
| 6029882 | Plastic solder array using injection molded solder | Lannie R. Bolde, Chon Cheong Lei | 2000-02-29 |
| 6003757 | Apparatus for transferring solder bumps and method of using | Guy D. Beaumont, Guy Paul Brouillette, David Danovitch | 1999-12-21 |
| 5982038 | Cast metal seal for semiconductor substrates | Hilton T. Toy, Lannie R. Bolde, James H. Covell, David L. Edwards, Lewis S. Goldmann | 1999-11-09 |
| 5961032 | Method of fabrication of a multi-component solder column by blocking a portion of a through hole in a mold | James H. Covell, Shaji Farooq, Sudipta K. Ray | 1999-10-05 |
| 5821161 | Cast metal seal for semiconductor substrates and process thereof | James H. Covell, Lannie R. Bolde, David L. Edwards, Lewis S. Goldmann, Hilton T. Toy | 1998-10-13 |
| 5775569 | Method for building interconnect structures by injection molded solder and structures built | Daniel G. Berger, Guy Paul Brouillette, David Danovitch, Rajesh Shankerlal Patel, Stephen Roux +2 more | 1998-07-07 |
| 5673846 | Solder anchor decal and method | — | 1997-10-07 |
| 5388635 | Compliant fluidic coolant hat | Arthur R. Zingher | 1995-02-14 |
| 5291371 | Thermal joint | Arthur R. Zingher | 1994-03-01 |
| 5244143 | Apparatus and method for injection molding solder and applications thereof | Thomas G. Ference, Bernardo Hernandez, Michael J. Palmer, Arthur R. Zingher | 1993-09-14 |
| 5198189 | Liquid metal matrix thermal paste | Richard B. Booth, Gary W. Grube, Igor Y. Khandros, Arthur R. Zingher | 1993-03-30 |
| 5173256 | Liquid metal matrix thermal paste | Richard B. Booth, Gary W. Grube, Igor Y. Khandros, Arthur R. Zingher | 1992-12-22 |
| 5022462 | Flexible finned heat exchanger | Ephraim B. Flint, Kurt R. Grebe, Arthur R. Zingher | 1991-06-11 |
| 4964458 | Flexible finned heat exchanger | Ephraim B. Flint, Kurt R. Grebe, Arthur R. Zingher | 1990-10-23 |
| 4730666 | Flexible finned heat exchanger | Ephraim B. Flint, Kurt R. Grebe, Arthur R. Zingher | 1988-03-15 |
| 4685606 | Oxide-free extruded thermal joint | Ephraim B. Flint, Ronald Franklin Marks, Graham Olive, Arthur R. Zingher | 1987-08-11 |
| 4549407 | Evaporative cooling | — | 1985-10-29 |