Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12344734 | Biodegradable material for additive manufacture | Donald L. Vanelli, Karl Freihart | 2025-07-01 |
| 12269207 | Biodegradable plastics for use in additive manufacturing processes | Donald L. Vanelli, Karl Freihart | 2025-04-08 |
| 11975482 | Pretreated material for laser sintering | Ryan A. Corbett, Joseph Tucker | 2024-05-07 |
| 11578201 | Biodegradable material for additive manufacturing | Donald L. Vanelli, Karl Freihart | 2023-02-14 |
| 9580551 | Method and system for laser sintering with pretreated material | Donald L. Vanelli, Bruce Thornton | 2017-02-28 |
| 8236418 | Methods and systems for fabricating fire retardant materials | Bruce Thornton, Donald L. Vanelli, Martha Leigh Gardiner | 2012-08-07 |
| 6197222 | Lead free conductive composites for electrical interconnections | Ravi F. Saraf, Judith Marie Roldan, Michael A. Gaynes, Steven P. Ostrander, Emanuel I. Cooper +1 more | 2001-03-06 |
| 5866044 | Lead free conductive composites for electrical interconnections | Ravi F. Saraf, Judith Marie Roldan, Michael A. Gaynes, Steven P. Ostrander, Emanuel I. Cooper +1 more | 1999-02-02 |
| 5817206 | Selective laser sintering of polymer powder of controlled particle size distribution | Kevin P. McAlea, Paul Forderhase | 1998-10-06 |
| 5749041 | Method of forming three-dimensional articles using thermosetting materials | Udaykumar Lakshminarayan, Kevin P. McAlea | 1998-05-05 |
| 5747101 | Direct chip attachment (DCA) with electrically conductive adhesives | Michael A. Gaynes, Robert M. Murcko, Viswanadham Puligandla, Judith Marie Roldan, Ravi F. Saraf +1 more | 1998-05-05 |
| 5545429 | Fabrication of double side fully metallized plated thru-holes, in polymer structures, without seeding or photoprocess | Emanuel I. Cooper, Edward A. Giess, Mark R. Kordus, Sol Krongelb, Steven P. Ostrander +3 more | 1996-08-13 |
| 5543585 | Direct chip attachment (DCA) with electrically conductive adhesives | Michael A. Gaynes, Robert M. Murco, Viswanadham Puligandla, Judith Marie Roldan, Ravi F. Saraf +1 more | 1996-08-06 |
| 5404044 | Parallel process interposer (PPI) | Robert H. Gephard, Bradley S. Gremban, Janet E. Poetzinger, David T. Shen | 1995-04-04 |
| 5386627 | Method of fabricating a multi-layer integrated circuit chip interposer | Robert H. Gephard, Bradley S. Gremban, Janet E. Poetzinger, David T. Shen | 1995-02-07 |
| 5384955 | Method for replacing IC chip package interposer | Robert H. Gephard, Bradley S. Gremban, Janet E. Poetzinger, David T. Shen | 1995-01-31 |
| 5213704 | Process for making a compliant thermally conductive compound | Herbert R. Anderson, Jr., Lawrence D. David, Mark Neisser, Harbans S. Sachdev, Mark A. Takacs | 1993-05-25 |
| 5198189 | Liquid metal matrix thermal paste | Gary W. Grube, Peter A. Gruber, Igor Y. Khandros, Arthur R. Zingher | 1993-03-30 |
| 5173256 | Liquid metal matrix thermal paste | Gary W. Grube, Peter A. Gruber, Igor Y. Khandros, Arthur R. Zingher | 1992-12-22 |
| 5094769 | Compliant thermally conductive compound | Herbert R. Anderson, Jr., Lawrence D. David, Mark Neisser, Harbans S. Sachdev, Mark A. Takacs | 1992-03-10 |