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Biodegradable material for additive manufacture |
Donald L. Vanelli, Karl Freihart |
2025-07-01 |
| 12269207 |
Biodegradable plastics for use in additive manufacturing processes |
Donald L. Vanelli, Karl Freihart |
2025-04-08 |
| 11975482 |
Pretreated material for laser sintering |
Ryan A. Corbett, Joseph Tucker |
2024-05-07 |
| 11578201 |
Biodegradable material for additive manufacturing |
Donald L. Vanelli, Karl Freihart |
2023-02-14 |
| 9580551 |
Method and system for laser sintering with pretreated material |
Donald L. Vanelli, Bruce Thornton |
2017-02-28 |
| 8236418 |
Methods and systems for fabricating fire retardant materials |
Bruce Thornton, Donald L. Vanelli, Martha Leigh Gardiner |
2012-08-07 |
| 6197222 |
Lead free conductive composites for electrical interconnections |
Ravi F. Saraf, Judith Marie Roldan, Michael A. Gaynes, Steven P. Ostrander, Emanuel I. Cooper +1 more |
2001-03-06 |
| 5866044 |
Lead free conductive composites for electrical interconnections |
Ravi F. Saraf, Judith Marie Roldan, Michael A. Gaynes, Steven P. Ostrander, Emanuel I. Cooper +1 more |
1999-02-02 |
| 5817206 |
Selective laser sintering of polymer powder of controlled particle size distribution |
Kevin P. McAlea, Paul Forderhase |
1998-10-06 |
| 5749041 |
Method of forming three-dimensional articles using thermosetting materials |
Udaykumar Lakshminarayan, Kevin P. McAlea |
1998-05-05 |
| 5747101 |
Direct chip attachment (DCA) with electrically conductive adhesives |
Michael A. Gaynes, Robert M. Murcko, Viswanadham Puligandla, Judith Marie Roldan, Ravi F. Saraf +1 more |
1998-05-05 |
| 5545429 |
Fabrication of double side fully metallized plated thru-holes, in polymer structures, without seeding or photoprocess |
Emanuel I. Cooper, Edward A. Giess, Mark R. Kordus, Sol Krongelb, Steven P. Ostrander +3 more |
1996-08-13 |
| 5543585 |
Direct chip attachment (DCA) with electrically conductive adhesives |
Michael A. Gaynes, Robert M. Murco, Viswanadham Puligandla, Judith Marie Roldan, Ravi F. Saraf +1 more |
1996-08-06 |
| 5404044 |
Parallel process interposer (PPI) |
Robert H. Gephard, Bradley S. Gremban, Janet E. Poetzinger, David T. Shen |
1995-04-04 |
| 5386627 |
Method of fabricating a multi-layer integrated circuit chip interposer |
Robert H. Gephard, Bradley S. Gremban, Janet E. Poetzinger, David T. Shen |
1995-02-07 |
| 5384955 |
Method for replacing IC chip package interposer |
Robert H. Gephard, Bradley S. Gremban, Janet E. Poetzinger, David T. Shen |
1995-01-31 |
| 5213704 |
Process for making a compliant thermally conductive compound |
Herbert R. Anderson, Jr., Lawrence D. David, Mark Neisser, Harbans S. Sachdev, Mark A. Takacs |
1993-05-25 |
| 5198189 |
Liquid metal matrix thermal paste |
Gary W. Grube, Peter A. Gruber, Igor Y. Khandros, Arthur R. Zingher |
1993-03-30 |
| 5173256 |
Liquid metal matrix thermal paste |
Gary W. Grube, Peter A. Gruber, Igor Y. Khandros, Arthur R. Zingher |
1992-12-22 |
| 5094769 |
Compliant thermally conductive compound |
Herbert R. Anderson, Jr., Lawrence D. David, Mark Neisser, Harbans S. Sachdev, Mark A. Takacs |
1992-03-10 |
