Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6596621 | Method of forming a lead-free tin-silver-copper based solder alloy on an electronic substrate | Bruce Anthony Copeland, Rebecca Y. Gorrell, Kenneth J. Travis, Jr., Jun Wang, Lovell B. Wiggins | 2003-07-22 |
| 6555912 | Corrosion-resistant electrode structure for integrated circuit decoupling capacitors | Bruce Anthony Copeland, Rebecca Y. Gorrell, Donald W. Scheider, Kenneth J. Travis, Jr., Peter O. Ulanmo +1 more | 2003-04-29 |
| 6336262 | Process of forming a capacitor with multi-level interconnection technology | Hormazdyar M. Dalal, Gene J. Gaudenzi, Rebecca Y. Gorrell, Kenneth J. Travis, Jr. | 2002-01-08 |
| 5808853 | Capacitor with multi-level interconnection technology | Hormazdyar M. Dalal, Gene J. Gaudenzi, Rebecca Y. Gorrell, Kenneth J. Travis, Jr. | 1998-09-15 |
| 5277725 | Process for fabricating a low dielectric composite substrate | John Acocella, Peter A. Agostino, Arnold I. Baise, Richard A. Bates, Ray M. Bryant +21 more | 1994-01-11 |
| 5213704 | Process for making a compliant thermally conductive compound | Herbert R. Anderson, Jr., Richard B. Booth, Lawrence D. David, Mark Neisser, Harbans S. Sachdev | 1993-05-25 |
| 5139851 | Low dielectric composite substrate | John Acocella, Arnold I. Baise, Richard A. Bates, Jon A. Casey, David R. Clarke +10 more | 1992-08-18 |
| 5135595 | Process for fabricating a low dielectric composite substrate | John Acocella, Peter A. Agostino, Arnold I. Baise, Richard A. Bates, Ray M. Bryant +21 more | 1992-08-04 |
| 5094769 | Compliant thermally conductive compound | Herbert R. Anderson, Jr., Richard B. Booth, Lawrence D. David, Mark Neisser, Harbans S. Sachdev | 1992-03-10 |
| 4871619 | Electronic components comprising polymide dielectric layers | Constance J. Araps, Steven M. Kandetzke | 1989-10-03 |
| 4749621 | Electronic components comprising polyimide-filled isolation structures | Constance J. Araps, Steven M. Kandetzke | 1988-06-07 |
| 4699803 | Method for forming electrical components comprising cured vinyl and/or acetylene terminated copolymers | Constance J. Araps, Steven M. Kandetzke | 1987-10-13 |
| 4665007 | Planarization process for organic filling of deep trenches | Nancy R. Cservak, Susan K. Fribley, George R. Goth | 1987-05-12 |
| 4656050 | Method of producing electronic components utilizing cured vinyl and/or acetylene terminated copolymers | Constance J. Araps, Steven M. Kandetzke | 1987-04-07 |
| 4654223 | Method for forming a film of dielectric material on an electric component | Constance J. Araps, Steven M. Kandetzke | 1987-03-31 |
| 4622383 | Method for the fractionation of reactive terminated polymerizable oligomers | Constance J. Araps, Steven M. Kandetzke | 1986-11-11 |
| 4599136 | Method for preparation of semiconductor structures and devices which utilize polymeric dielectric materials | Constance J. Araps, Steven M. Kandetzke, Ellen L. Kutner | 1986-07-08 |
| 4568601 | Use of radiation sensitive polymerizable oligomers to produce polyimide negative resists and planarized dielectric components for semiconductor structures | Constance J. Araps, George Czornyj, Steven M. Kandetzke | 1986-02-04 |