| 6596621 |
Method of forming a lead-free tin-silver-copper based solder alloy on an electronic substrate |
Bruce Anthony Copeland, Rebecca Y. Gorrell, Kenneth J. Travis, Jr., Jun Wang, Lovell B. Wiggins |
2003-07-22 |
| 6555912 |
Corrosion-resistant electrode structure for integrated circuit decoupling capacitors |
Bruce Anthony Copeland, Rebecca Y. Gorrell, Donald W. Scheider, Kenneth J. Travis, Jr., Peter O. Ulanmo +1 more |
2003-04-29 |
| 6336262 |
Process of forming a capacitor with multi-level interconnection technology |
Hormazdyar M. Dalal, Gene J. Gaudenzi, Rebecca Y. Gorrell, Kenneth J. Travis, Jr. |
2002-01-08 |
| 5808853 |
Capacitor with multi-level interconnection technology |
Hormazdyar M. Dalal, Gene J. Gaudenzi, Rebecca Y. Gorrell, Kenneth J. Travis, Jr. |
1998-09-15 |
| 5277725 |
Process for fabricating a low dielectric composite substrate |
John Acocella, Peter A. Agostino, Arnold I. Baise, Richard A. Bates, Ray M. Bryant +21 more |
1994-01-11 |
| 5213704 |
Process for making a compliant thermally conductive compound |
Herbert R. Anderson, Jr., Richard B. Booth, Lawrence D. David, Mark Neisser, Harbans S. Sachdev |
1993-05-25 |
| 5139851 |
Low dielectric composite substrate |
John Acocella, Arnold I. Baise, Richard A. Bates, Jon A. Casey, David R. Clarke +10 more |
1992-08-18 |
| 5135595 |
Process for fabricating a low dielectric composite substrate |
John Acocella, Peter A. Agostino, Arnold I. Baise, Richard A. Bates, Ray M. Bryant +21 more |
1992-08-04 |
| 5094769 |
Compliant thermally conductive compound |
Herbert R. Anderson, Jr., Richard B. Booth, Lawrence D. David, Mark Neisser, Harbans S. Sachdev |
1992-03-10 |
| 4871619 |
Electronic components comprising polymide dielectric layers |
Constance J. Araps, Steven M. Kandetzke |
1989-10-03 |
| 4749621 |
Electronic components comprising polyimide-filled isolation structures |
Constance J. Araps, Steven M. Kandetzke |
1988-06-07 |
| 4699803 |
Method for forming electrical components comprising cured vinyl and/or acetylene terminated copolymers |
Constance J. Araps, Steven M. Kandetzke |
1987-10-13 |
| 4665007 |
Planarization process for organic filling of deep trenches |
Nancy R. Cservak, Susan K. Fribley, George R. Goth |
1987-05-12 |
| 4656050 |
Method of producing electronic components utilizing cured vinyl and/or acetylene terminated copolymers |
Constance J. Araps, Steven M. Kandetzke |
1987-04-07 |
| 4654223 |
Method for forming a film of dielectric material on an electric component |
Constance J. Araps, Steven M. Kandetzke |
1987-03-31 |
| 4622383 |
Method for the fractionation of reactive terminated polymerizable oligomers |
Constance J. Araps, Steven M. Kandetzke |
1986-11-11 |
| 4599136 |
Method for preparation of semiconductor structures and devices which utilize polymeric dielectric materials |
Constance J. Araps, Steven M. Kandetzke, Ellen L. Kutner |
1986-07-08 |
| 4568601 |
Use of radiation sensitive polymerizable oligomers to produce polyimide negative resists and planarized dielectric components for semiconductor structures |
Constance J. Araps, George Czornyj, Steven M. Kandetzke |
1986-02-04 |
