| 5277725 |
Process for fabricating a low dielectric composite substrate |
John Acocella, Peter A. Agostino, Richard A. Bates, Ray M. Bryant, Jon A. Casey +21 more |
1994-01-11 |
| 5139851 |
Low dielectric composite substrate |
John Acocella, Richard A. Bates, Jon A. Casey, David R. Clarke, Renuka S. Divakaruni +10 more |
1992-08-18 |
| 5139852 |
Low dielectric composite substrate |
Ray M. Bryant, Jon A. Casey, Allen J. Dam, Werner E. Dunkel, James N. Humenik +4 more |
1992-08-18 |
| 5135595 |
Process for fabricating a low dielectric composite substrate |
John Acocella, Peter A. Agostino, Richard A. Bates, Ray M. Bryant, Jon A. Casey +21 more |
1992-08-04 |
| 4507333 |
Biphenylene end-capped quinoxaline polymers and their use as insulating coatings for semiconductor devices |
Anthony W. Wu |
1985-03-26 |
| 4371565 |
Process for adhering an organic resin to a substrate by means of plasma polymerized phosphines |
John M. Burns, Harbans S. Sachdev |
1983-02-01 |
| 4339526 |
Acetylene terminated, branched polyphenylene resist and protective coating for integrated circuit devices |
George Czornyj, Anthony W. Wu |
1982-07-13 |
