Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6358439 | Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias | Farid Youssif Aoude, Lawrence D. David, Shaji Farooq, Lester W. Herron, Hal Mitchell Lasky +6 more | 2002-03-19 |
| 6124041 | Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias | Farid Youssif Aoude, Lawrence D. David, Shaji Farooq, Lester W. Herron, Hal Mitchell Lasky +6 more | 2000-09-26 |
| 5925443 | Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias | Farid Youssif Aoude, Lawrence D. David, Shaji Farooq, Lester W. Herron, Hal Mitchell Lasky +6 more | 1999-07-20 |
| 5468445 | Ceramic via composition, multilayer ceramic circuit containing same, and process for using same | Jon A. Casey, Govindarajan Natarajan, Srinivasa S. N. Reddy, Manfred Sammet | 1995-11-21 |
| 5336444 | Ceramic via composition, multilayer ceramic circuit containing same, and process for using same | Jon A. Casey, Govindarajan Natarajan, Srinivasa S. N. Reddy, Manfred Sammet | 1994-08-09 |
| 5277725 | Process for fabricating a low dielectric composite substrate | John Acocella, Peter A. Agostino, Arnold I. Baise, Richard A. Bates, Ray M. Bryant +21 more | 1994-01-11 |
| 5147741 | Phenyl-endcapped depolymerizable polymer | Constance J. Araps, Jon A. Casey, Steven M. Kandetzke, Catherine A. Lotsko | 1992-09-15 |
| 5139851 | Low dielectric composite substrate | John Acocella, Arnold I. Baise, Richard A. Bates, Jon A. Casey, David R. Clarke +10 more | 1992-08-18 |
| 5135595 | Process for fabricating a low dielectric composite substrate | John Acocella, Peter A. Agostino, Arnold I. Baise, Richard A. Bates, Ray M. Bryant +21 more | 1992-08-04 |
| 4987211 | Phenyl-endcapped depolymerizable polymer | Constance J. Araps, Jon A. Casey, Steven M. Kandetzke, Chatherine A. Lotsko | 1991-01-22 |
| 4885038 | Method of making multilayered ceramic structures having an internal distribution of copper-based conductors | Herbert R. Anderson, Jr., Joseph M. Dynys, Steven M. Kandetzke, Daniel P. Kirby, Raj N. Master +1 more | 1989-12-05 |
| 4772346 | Method of bonding inorganic particulate material | Herbert R. Anderson, Jr., Constance J. Araps, Daniel P. Kirby, Robert W. Nufer, Harbans S. Sachdev +3 more | 1988-09-20 |