Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5277725 | Process for fabricating a low dielectric composite substrate | John Acocella, Peter A. Agostino, Arnold I. Baise, Richard A. Bates, Ray M. Bryant +21 more | 1994-01-11 |
| 5147741 | Phenyl-endcapped depolymerizable polymer | Constance J. Araps, Jon A. Casey, Renuka S. Divakaruni, Catherine A. Lotsko | 1992-09-15 |
| 5139851 | Low dielectric composite substrate | John Acocella, Arnold I. Baise, Richard A. Bates, Jon A. Casey, David R. Clarke +10 more | 1992-08-18 |
| 5135595 | Process for fabricating a low dielectric composite substrate | John Acocella, Peter A. Agostino, Arnold I. Baise, Richard A. Bates, Ray M. Bryant +21 more | 1992-08-04 |
| 4987211 | Phenyl-endcapped depolymerizable polymer | Constance J. Araps, Jon A. Casey, Renuka S. Divakaruni, Chatherine A. Lotsko | 1991-01-22 |
| 4885038 | Method of making multilayered ceramic structures having an internal distribution of copper-based conductors | Herbert R. Anderson, Jr., Renuka S. Divakaruni, Joseph M. Dynys, Daniel P. Kirby, Raj N. Master +1 more | 1989-12-05 |
| 4871619 | Electronic components comprising polymide dielectric layers | Constance J. Araps, Mark A. Takacs | 1989-10-03 |
| 4749621 | Electronic components comprising polyimide-filled isolation structures | Constance J. Araps, Mark A. Takacs | 1988-06-07 |
| 4699803 | Method for forming electrical components comprising cured vinyl and/or acetylene terminated copolymers | Constance J. Araps, Mark A. Takacs | 1987-10-13 |
| 4656050 | Method of producing electronic components utilizing cured vinyl and/or acetylene terminated copolymers | Constance J. Araps, Mark A. Takacs | 1987-04-07 |
| 4654223 | Method for forming a film of dielectric material on an electric component | Constance J. Araps, Mark A. Takacs | 1987-03-31 |
| 4622383 | Method for the fractionation of reactive terminated polymerizable oligomers | Constance J. Araps, Mark A. Takacs | 1986-11-11 |
| 4599136 | Method for preparation of semiconductor structures and devices which utilize polymeric dielectric materials | Constance J. Araps, Ellen L. Kutner, Mark A. Takacs | 1986-07-08 |
| 4568601 | Use of radiation sensitive polymerizable oligomers to produce polyimide negative resists and planarized dielectric components for semiconductor structures | Constance J. Araps, George Czornyj, Mark A. Takacs | 1986-02-04 |