Steven M. Kandetzke — 14 Patents at IBM

Steven M. Kandetzke has been granted 14 US patents while listed as an inventor at IBM. The first was granted in 1986 and the most recent in January 1994. Steven M. Kandetzke ranks #332,869 of 4,157,543 US inventors in our database (top 8.0%). Patent records list Steven M. Kandetzke in Fishkill, NY, US.

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Showing 1–14 of 14 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
5277725	Process for fabricating a low dielectric composite substrate	John Acocella, Peter A. Agostino, Arnold I. Baise, Richard A. Bates, Ray M. Bryant +21 more	1994-01-11	$8,526,000
5147741	Phenyl-endcapped depolymerizable polymer	Constance J. Araps, Jon A. Casey, Renuka S. Divakaruni, Catherine A. Lotsko	1992-09-15	$12,539,000
5139851	Low dielectric composite substrate	John Acocella, Arnold I. Baise, Richard A. Bates, Jon A. Casey, David R. Clarke +10 more	1992-08-18	$15,391,000
5135595	Process for fabricating a low dielectric composite substrate	John Acocella, Peter A. Agostino, Arnold I. Baise, Richard A. Bates, Ray M. Bryant +21 more	1992-08-04	$10,228,000
4987211	Phenyl-endcapped depolymerizable polymer	Constance J. Araps, Jon A. Casey, Renuka S. Divakaruni, Chatherine A. Lotsko	1991-01-22	$20,506,000
4885038	Method of making multilayered ceramic structures having an internal distribution of copper-based conductors	Herbert R. Anderson, Jr., Renuka S. Divakaruni, Joseph M. Dynys, Daniel P. Kirby, Raj N. Master +1 more	1989-12-05	$12,280,000
4871619	Electronic components comprising polymide dielectric layers	Constance J. Araps, Mark A. Takacs	1989-10-03	$18,174,000
4749621	Electronic components comprising polyimide-filled isolation structures	Constance J. Araps, Mark A. Takacs	1988-06-07	$33,030,000
4699803	Method for forming electrical components comprising cured vinyl and/or acetylene terminated copolymers	Constance J. Araps, Mark A. Takacs	1987-10-13	$44,185,000
4656050	Method of producing electronic components utilizing cured vinyl and/or acetylene terminated copolymers	Constance J. Araps, Mark A. Takacs	1987-04-07	$23,147,000
4654223	Method for forming a film of dielectric material on an electric component	Constance J. Araps, Mark A. Takacs	1987-03-31	$21,269,000
4622383	Method for the fractionation of reactive terminated polymerizable oligomers	Constance J. Araps, Mark A. Takacs	1986-11-11	$26,455,000
4599136	Method for preparation of semiconductor structures and devices which utilize polymeric dielectric materials	Constance J. Araps, Ellen L. Kutner, Mark A. Takacs	1986-07-08	$22,430,000
4568601	Use of radiation sensitive polymerizable oligomers to produce polyimide negative resists and planarized dielectric components for semiconductor structures	Constance J. Araps, George Czornyj, Mark A. Takacs	1986-02-04	$19,748,000

Steven M. Kandetzke — 14 Patents

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