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Home › Method for preparation of semiconductor structures and devices which utilize polymeric dielectric materials

Method for preparation of semiconductor structures and devices which utilize polymeric dielectric materials

US Patent 4599136 · Granted Jul 8, 1986

Estimated economic value: $22,430,000 ⓘ

Assignee

IBM

Inventors

Constance J. Araps (15 patents)
Steven M. Kandetzke (14 patents)
Ellen L. Kutner (1 patents)
Mark A. Takacs (18 patents)

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