Constance J. Araps — 15 Patents at IBM

Constance J. Araps has been granted 15 US patents while listed as an inventor at IBM. The first was granted in 1984 and the most recent in September 1992. Constance J. Araps ranks #307,048 of 4,157,543 US inventors in our database (top 7.4%). Patent records list Constance J. Araps in Wappingers Falls, NY, US.

Patents per Year

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Showing 1–15 of 15 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
5147741	Phenyl-endcapped depolymerizable polymer	Jon A. Casey, Renuka S. Divakaruni, Steven M. Kandetzke, Catherine A. Lotsko	1992-09-15	$12,539,000
5049201	Method of inhibiting corrosion in an electronic package	Shirley N. Cheng, Allen J. Arnold, Jeffrey T. Coffin, Luu Thanh Nguyen	1991-09-17	$19,057,000
4987211	Phenyl-endcapped depolymerizable polymer	Jon A. Casey, Renuka S. Divakaruni, Steven M. Kandetzke, Chatherine A. Lotsko	1991-01-22	$20,506,000
4871619	Electronic components comprising polymide dielectric layers	Steven M. Kandetzke, Mark A. Takacs	1989-10-03	$18,174,000
4772346	Method of bonding inorganic particulate material	Herbert R. Anderson, Jr., Renuka S. Divakaruni, Daniel P. Kirby, Robert W. Nufer, Harbans S. Sachdev +3 more	1988-09-20	$31,493,000
4749621	Electronic components comprising polyimide-filled isolation structures	Steven M. Kandetzke, Mark A. Takacs	1988-06-07	$33,030,000
4699803	Method for forming electrical components comprising cured vinyl and/or acetylene terminated copolymers	Steven M. Kandetzke, Mark A. Takacs	1987-10-13	$44,185,000
4656050	Method of producing electronic components utilizing cured vinyl and/or acetylene terminated copolymers	Steven M. Kandetzke, Mark A. Takacs	1987-04-07	$23,147,000
4654223	Method for forming a film of dielectric material on an electric component	Steven M. Kandetzke, Mark A. Takacs	1987-03-31	$21,269,000
4622383	Method for the fractionation of reactive terminated polymerizable oligomers	Steven M. Kandetzke, Mark A. Takacs	1986-11-11	$26,455,000
4599136	Method for preparation of semiconductor structures and devices which utilize polymeric dielectric materials	Steven M. Kandetzke, Ellen L. Kutner, Mark A. Takacs	1986-07-08	$22,430,000
4568601	Use of radiation sensitive polymerizable oligomers to produce polyimide negative resists and planarized dielectric components for semiconductor structures	George Czornyj, Steven M. Kandetzke, Mark A. Takacs	1986-02-04	$19,748,000
4539222	Process for forming metal patterns wherein metal is deposited on a thermally depolymerizable polymer and selectively removed	Herbert R. Anderson, Jr., Catherine A. Lotsko	1985-09-03	$15,376,000
4504007	Solder and braze fluxes and processes for using the same	Herbert R. Anderson, Jr., Richard A. Bates	1985-03-12	$12,005,000
4456675	Dry process for forming metal patterns wherein metal is deposited on a depolymerizable polymer and selectively removed	Herbert R. Anderson, Jr., Catherine A. Lotsko	1984-06-26	$14,457,000

Constance J. Araps — 15 Patents

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