Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5401911 | Via and pad structure for thermoplastic substrates and method and apparatus for forming the same | Arthur Bross, Julian G. Cempa, Robert O. Lussow, Donald E. Myers, Thomas J. Walsh | 1995-03-28 |
| 5276964 | Method of manufacturing a high density connector system | Arthur Bross, Julian G. Cempa, Robert O. Lussow, Donald E. Myers, Thomas J. Walsh | 1994-01-11 |
| 5213704 | Process for making a compliant thermally conductive compound | Richard B. Booth, Lawrence D. David, Mark Neisser, Harbans S. Sachdev, Mark A. Takacs | 1993-05-25 |
| 5205738 | High density connector system | Arthur Bross, Julian G. Cempa, Robert O. Lussow, Donald E. Myers, Thomas J. Walsh | 1993-04-27 |
| 5094769 | Compliant thermally conductive compound | Richard B. Booth, Lawrence D. David, Mark Neisser, Harbans S. Sachdev, Mark A. Takacs | 1992-03-10 |
| 4885038 | Method of making multilayered ceramic structures having an internal distribution of copper-based conductors | Renuka S. Divakaruni, Joseph M. Dynys, Steven M. Kandetzke, Daniel P. Kirby, Raj N. Master +1 more | 1989-12-05 |
| 4772346 | Method of bonding inorganic particulate material | Constance J. Araps, Renuka S. Divakaruni, Daniel P. Kirby, Robert W. Nufer, Harbans S. Sachdev +3 more | 1988-09-20 |
| 4539222 | Process for forming metal patterns wherein metal is deposited on a thermally depolymerizable polymer and selectively removed | Constance J. Araps, Catherine A. Lotsko | 1985-09-03 |
| 4519872 | Use of depolymerizable polymers in the fabrication of lift-off structure for multilevel metal processes | Harbans S. Sachdev, Krishna G. Sachdev | 1985-05-28 |
| 4504007 | Solder and braze fluxes and processes for using the same | Constance J. Araps, Richard A. Bates | 1985-03-12 |
| 4456675 | Dry process for forming metal patterns wherein metal is deposited on a depolymerizable polymer and selectively removed | Constance J. Araps, Catherine A. Lotsko | 1984-06-26 |