| 7670961 |
Reduction of cracking in low-k spin-on dielectric films |
Howard Shillingford, Garkay Joseph Leung, Mary Matera-Longo, John Rapp |
2010-03-02 |
|
| 6635118 |
Aqueous cleaning of polymer apply equipment |
Richard A. Cormack, Gerard V. Capogna, Felice J. Mancaruso, Krishna G. Sachdev |
2003-10-21 |
$7,269,000 |
| 6153696 |
Process for forming carbonates of hydroxyaromatic compounds |
Gregory Breyta, Daniel J. Dawson, Moahmoud Mostafa Khojasteh, Ranee W. Kwong, Elwood Herbert Macy +5 more |
2000-11-28 |
$55,341,000 |
| 5976710 |
Low TCE polyimides as improved insulator in multilayer interconnect structures |
Krishna G. Sachdev, John P. Hummel, Sundar M. Kamath, Robert N. Lang, Anton Nendaic +1 more |
1999-11-02 |
$18,540,000 |
| 5422223 |
Silicon-containing positive resist and use in multilayer metal structures |
Krishna G. Sachdev, Joel R. Whitaker |
1995-06-06 |
$7,414,000 |
| 5399462 |
Method of forming sub-half micron patterns with optical lithography using bilayer resist compositions comprising a photosensitive polysilsesquioxane |
Krishna G. Sachdev, Premlatha Jagannathan, Robert N. Lang, Ratnam Sooriyakumaran, Joel R. Whitaker |
1995-03-21 |
$19,868,000 |
| 5385804 |
Silicon containing negative resist for DUV, I-line or E-beam lithography comprising an aromatic azide side group in the polysilsesquioxane polymer |
Jagannathan Premlatha, Ratnam Sooriyakumaran |
1995-01-31 |
$9,170,000 |
| 5338818 |
Silicon containing positive resist for DUV lithography |
William R. Brunsvold, Premlatha Jagannathan, Steve S. Miura, Melvin Montgomery, Ratnam Sooriyakumaran |
1994-08-16 |
$10,305,000 |
| 5322765 |
Dry developable photoresist compositions and method for use thereof |
Nicholas J. Clecak, Willard E. Conley, Ranee W. Kwong, Leo L. Linehan, Scott A. MacDonald +2 more |
1994-06-21 |
$13,003,000 |
| 5312717 |
Residue free vertical pattern transfer with top surface imaging resists |
John C. Forster, Leo L. Linehan, Scott A. MacDonald, K. Paul Muller, Walter E. Mlynko +1 more |
1994-05-17 |
$6,984,000 |
| 5296332 |
Crosslinkable aqueous developable photoresist compositions and method for use thereof |
Willard E. Conley, Premlatha Jagannathan, Ahmad D. Katnani, Ranee W. Kwong, Leo L. Linehan +2 more |
1994-03-22 |
$7,732,000 |
| 5240812 |
Top coat for acid catalyzed resists |
Willard E. Conley, Ranee W. Kwong, Richard J. Kvitek, Robert N. Lang, Christopher F. Lyons +3 more |
1993-08-31 |
$6,793,000 |
| 5213704 |
Process for making a compliant thermally conductive compound |
Herbert R. Anderson, Jr., Richard B. Booth, Lawrence D. David, Mark Neisser, Mark A. Takacs |
1993-05-25 |
$9,080,000 |
| 5114826 |
Photosensitive polyimide compositions |
Ranee W. Kwong, Krishna G. Sachdev |
1992-05-19 |
$17,072,000 |
| 5115090 |
Viscosity stable, essentially gel-free polyamic acid compositions |
Krishna G. Sachdev, John P. Hummel, Ranee W. Kwong, Robert N. Lang, Leo L. Linehan |
1992-05-19 |
|
| 5094769 |
Compliant thermally conductive compound |
Herbert R. Anderson, Jr., Richard B. Booth, Lawrence D. David, Mark Neisser, Mark A. Takacs |
1992-03-10 |
$26,261,000 |
| 4978594 |
Fluorine-containing base layer for multi-layer resist processes |
James A. Bruce, Michael L. Kerbaugh, Ranee W. Kwong, Tanya N. Lee, Harold G. Linde |
1990-12-18 |
$16,946,000 |
| 4826564 |
Method of selective reactive ion etching of substrates |
Brian H. Desilets, Richard D. Kaplan, Krishna G. Sachdev, Susan Sanchez |
1989-05-02 |
$25,785,000 |
| 4772346 |
Method of bonding inorganic particulate material |
Herbert R. Anderson, Jr., Constance J. Araps, Renuka S. Divakaruni, Daniel P. Kirby, Robert W. Nufer +3 more |
1988-09-20 |
$31,493,000 |
| 4692205 |
Silicon-containing polyimides as oxygen etch stop and dual dielectric coatings |
Krishna G. Sachdev, Ranee W. Kwong, Mani R. Gupta, Mark S. Chace |
1987-09-08 |
$31,369,000 |
| 4665006 |
Positive resist system having high resistance to oxygen reactive ion etching |
Krishna G. Sachdev, Ranee W. Kwong, Mahmoud Khojasteh |
1987-05-12 |
$36,712,000 |
| 4599243 |
Use of plasma polymerized organosilicon films in fabrication of lift-off masks |
Krishna G. Sachdev |
1986-07-08 |
$22,430,000 |
| 4562091 |
Use of plasma polymerized orgaosilicon films in fabrication of lift-off masks |
Krishna G. Sachdev |
1985-12-31 |
$22,280,000 |
| 4525722 |
Chemical heat amplification in thermal transfer printing |
Krishna G. Sachdev, Ari Aviram, Mark A. Wizner |
1985-06-25 |
$17,193,000 |
| 4519872 |
Use of depolymerizable polymers in the fabrication of lift-off structure for multilevel metal processes |
Herbert R. Anderson, Jr., Krishna G. Sachdev |
1985-05-28 |
$15,645,000 |
