| 5926689 |
Process for reducing circuit damage during PECVD in single wafer PECVD system |
Donna R. Cote, Virinder Grewal, Anthony Konecni, Dragan Podlesnik |
1999-07-20 |
| 5650032 |
Apparatus for producing an inductive plasma for plasma processes |
John H. Keller, Michael Barnes, John E. Heidenreich, III |
1997-07-22 |
| 5543184 |
Method of reducing particulates in a plasma tool through steady state flows |
Michael Barnes, Dennis K. Coultas, John H. Keller, Thomas E. Wicker |
1996-08-06 |
| 5518547 |
Method and apparatus for reducing particulates in a plasma tool through steady state flows |
Michael Barnes, Dennis K. Coultas, John H. Keller, Thomas E. Wicker |
1996-05-21 |
| 5433258 |
Gettering of particles during plasma processing |
Michael Barnes, Dennis K. Coultas, John H. Keller, James A. O'Neill |
1995-07-18 |
| 5382911 |
Reaction chamber interelectrode gap monitoring by capacitance measurement |
Tina J. Cotler, Lawrence Andrew Kropp, Jyothi Singh |
1995-01-17 |
| 5332441 |
Apparatus for gettering of particles during plasma processing |
Michael Barnes, Dennis K. Coultas, John H. Keller, James A. O'Neill |
1994-07-26 |
| 5312717 |
Residue free vertical pattern transfer with top surface imaging resists |
Harbans S. Sachdev, Leo L. Linehan, Scott A. MacDonald, K. Paul Muller, Walter E. Mlynko +1 more |
1994-05-17 |
| 5284549 |
Selective fluorocarbon-based RIE process utilizing a nitrogen additive |
Michael Barnes, Melanie M. Chow, Michael Fury, Chang-Ching Kin, Harris C. Jones +2 more |
1994-02-08 |
| 5207437 |
Ceramic electrostatic wafer chuck |
Michael Barnes, Dennis K. Coultas, John H. Keller |
1993-05-04 |
| 5208512 |
Scanned electron cyclotron resonance plasma source |
William M. Holber, Joseph S. Logan |
1993-05-04 |
| 5189446 |
Plasma wafer processing tool having closed electron cyclotron resonance |
Michael Barnes, John H. Keller |
1993-02-23 |
| 5178739 |
Apparatus for depositing material into high aspect ratio holes |
Michael Barnes, John H. Keller |
1993-01-12 |
