Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5926689 | Process for reducing circuit damage during PECVD in single wafer PECVD system | Donna R. Cote, Virinder Grewal, Anthony Konecni, Dragan Podlesnik | 1999-07-20 |
| 5650032 | Apparatus for producing an inductive plasma for plasma processes | John H. Keller, Michael Barnes, John E. Heidenreich, III | 1997-07-22 |
| 5543184 | Method of reducing particulates in a plasma tool through steady state flows | Michael Barnes, Dennis K. Coultas, John H. Keller, Thomas E. Wicker | 1996-08-06 |
| 5518547 | Method and apparatus for reducing particulates in a plasma tool through steady state flows | Michael Barnes, Dennis K. Coultas, John H. Keller, Thomas E. Wicker | 1996-05-21 |
| 5433258 | Gettering of particles during plasma processing | Michael Barnes, Dennis K. Coultas, John H. Keller, James A. O'Neill | 1995-07-18 |
| 5382911 | Reaction chamber interelectrode gap monitoring by capacitance measurement | Tina J. Cotler, Lawrence Andrew Kropp, Jyothi Singh | 1995-01-17 |
| 5332441 | Apparatus for gettering of particles during plasma processing | Michael Barnes, Dennis K. Coultas, John H. Keller, James A. O'Neill | 1994-07-26 |
| 5312717 | Residue free vertical pattern transfer with top surface imaging resists | Harbans S. Sachdev, Leo L. Linehan, Scott A. MacDonald, K. Paul Muller, Walter E. Mlynko +1 more | 1994-05-17 |
| 5284549 | Selective fluorocarbon-based RIE process utilizing a nitrogen additive | Michael Barnes, Melanie M. Chow, Michael Fury, Chang-Ching Kin, Harris C. Jones +2 more | 1994-02-08 |
| 5207437 | Ceramic electrostatic wafer chuck | Michael Barnes, Dennis K. Coultas, John H. Keller | 1993-05-04 |
| 5208512 | Scanned electron cyclotron resonance plasma source | William M. Holber, Joseph S. Logan | 1993-05-04 |
| 5189446 | Plasma wafer processing tool having closed electron cyclotron resonance | Michael Barnes, John H. Keller | 1993-02-23 |
| 5178739 | Apparatus for depositing material into high aspect ratio holes | Michael Barnes, John H. Keller | 1993-01-12 |