Issued Patents All Time
Showing 25 most recent of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8983631 | Arrangement for identifying uncontrolled events at the process module level and methods thereof | Chung-Ho Huang, Vijayakumar C. Venugopal, Connie Lam | 2015-03-17 |
| 8828145 | Method of particle contaminant removal | Yizhak Sabba, Seokmin Yun, Mark Kawaguchi, Mark Wilcoxson | 2014-09-09 |
| 8652266 | Method and apparatus for surface treatment of semiconductor substrates using sequential chemical applications | Katrina Mikhaylichenko, Yizhak Sabba | 2014-02-18 |
| 8226775 | Methods for particle removal by single-phase and two-phase media | David Mui, Satish SRINIVASAN, Grant Peng, Ji Zhu, Shih-Chung Kon +1 more | 2012-07-24 |
| 8211846 | Materials for particle removal by single-phase and two-phase media | David Mui, Satish SRINIVASAN, Grant Peng, Ji Zhu, Shih-Chung Kon +1 more | 2012-07-03 |
| 8084406 | Apparatus for particle removal by single-phase and two-phase media | David Mui, Satish SRINIVASAN, Grant Peng, Ji Zhu, Shih-Chung Kon +1 more | 2011-12-27 |
| 6897155 | Method for etching high-aspect-ratio features | Ajay Kumar, Anisul Khan, Sharma Pamarthy, Axel Henke, Stephan Wege +1 more | 2005-05-24 |
| 6827869 | Method of micromachining a multi-part cavity | Thorsten Lill, Jeff Chinn, Shaoher X. Pan, Anisul Khan, Maocheng Li +1 more | 2004-12-07 |
| 6808647 | Methodologies to reduce process sensitivity to the chamber condition | Songlin Xu, Zhiwen Sun, Xueyu Qian | 2004-10-26 |
| 6802933 | Apparatus for performing self cleaning method of forming deep trenches in silicon substrates | Anisul Khan, Ajay Kumar, Jeffrey D. Chinn | 2004-10-12 |
| 6696365 | Process for in-situ etching a hardmask stack | Ajay Kumar, Anisul Khan, Sanjay Thekdi | 2004-02-24 |
| 6653237 | High resist-selectivity etch for silicon trench etch applications | Shashank Deshmukh, David Mui, Jeffrey D. Chinn | 2003-11-25 |
| 6642127 | Method for dicing a semiconductor wafer | Ajay Kumar, Padmapani Nallan, Anisul Khan | 2003-11-04 |
| 6593244 | Process for etching conductors at high etch rates | Yiqiong Wang, Anisul Khan, Ajay Kumar, Sharma Pamarthy | 2003-07-15 |
| 6583063 | Plasma etching of silicon using fluorinated gas mixtures | Anisul Khan, Nam Hun Kim, Gene Lee | 2003-06-24 |
| 6518192 | Two etchant etch method | Anisul Khan, Ajay Kumar, Jeffrey D. Chinn | 2003-02-11 |
| 6471833 | High etch rate method for plasma etching silicon nitride | Ajay Kumar, Anisul Khan, Jeffrey D. Chin | 2002-10-29 |
| 6391788 | Two etchant etch method | Anisul Khan, Ajay Kumar, Jeffrey D. Chinn | 2002-05-21 |
| 6383941 | Method of etching organic ARCs in patterns having variable spacings | Meihua Shen, Kenju Nishikido, Jeffrey D. Chinn | 2002-05-07 |
| 6380095 | Silicon trench etch using silicon-containing precursors to reduce or avoid mask erosion | Wei Liu, Yiqiong Wang, Maocheng Li, Anisul Khan, Shaoher X. Pan | 2002-04-30 |
| 6372655 | Two etchant etch method | Anisul Khan, Ajay Kumar, Jeffrey D. Chinn | 2002-04-16 |
| 6318384 | Self cleaning method of forming deep trenches in silicon substrates | Anisul Khan, Ajay Kumar, Jeffrey D. Chinn | 2001-11-20 |
| 6303513 | Method for controlling a profile of a structure formed on a substrate | Anisul Khan, Ajay Kumar, Jeffrey D. Chinn | 2001-10-16 |
| 6270634 | Method for plasma etching at a high etch rate | Ajay Kumar, Anisul Khan, Jeffrey D. Chinn | 2001-08-07 |
| 6235643 | Method for etching a trench having rounded top and bottom corners in a silicon substrate | David Mui, Wei Liu, Gene Lee, Nam Hun Kim, Jeff Chinn | 2001-05-22 |