| 10431458 |
Mask shrink layer for high aspect ratio dielectric etch |
Eric A. Hudson, Kalman Pelhos, Hyunjong Shim, Merrett Wong |
2019-10-01 |
$27,307,000 |
| 10170323 |
Technique to deposit metal-containing sidewall passivation for high aspect ratio cylinder etch |
Eric A. Hudson, Kalman Pelhos, Hyung Joo Shin |
2019-01-01 |
|
| 9673058 |
Method for etching features in dielectric layers |
Scott Briggs, Eric A. Hudson, Leonid Belau, John Holland |
2017-06-06 |
$18,995,000 |
| 9620377 |
Technique to deposit metal-containing sidewall passivation for high aspect ratio cylinder etch |
Eric A. Hudson, Kalman Pelhos, Hyung Joo Shin |
2017-04-11 |
|
| 9543148 |
Mask shrink layer for high aspect ratio dielectric etch |
Eric A. Hudson, Kalman Pelhos, Hyunjong Shim, Merrett Wong |
2017-01-10 |
$16,626,000 |
| 9236279 |
Method of dielectric film treatment |
Seokmin Yun, Ji Zhu, John deLarios |
2016-01-12 |
$16,109,000 |
| 9159593 |
Method of particle contaminant removal |
Mark Kawaguchi, David Mui |
2015-10-13 |
$28,526,000 |
| 8900374 |
Method for substrate cleaning including movement of substrate below substrate cleaning module |
Cheng-Yu Lin, Mark Kawaguchi, Russell Martin, Leon Ginzburg |
2014-12-02 |
$6,421,000 |
| 8828145 |
Method of particle contaminant removal |
Yizhak Sabba, Seokmin Yun, Mark Kawaguchi, Dragan Podlesnik |
2014-09-09 |
$10,421,000 |
| 8757177 |
Multi-stage substrate cleaning method and apparatus |
Arnold Kholodenko, Katrina Mikhaylichenko, Cheng-Yu Lin, Leon Ginzburg, Mark Kawaguchi |
2014-06-24 |
$19,471,000 |
| 8534303 |
Carrier for reducing entrance and/or exit marks left by a substrate-processing meniscus |
Robert O'Donnell, Eric H. Lenz, Mike Ravkin, Alexander A. Yatskar |
2013-09-17 |
$6,583,000 |
| 8440573 |
Method and apparatus for pattern collapse free wet processing of semiconductor devices |
Katrina Mikhaylichenko, Denis Syomin, Qian Fu, Glenn W. Gale, Shenjian Liu |
2013-05-14 |
$6,454,000 |
| 8317934 |
Multi-stage substrate cleaning method and apparatus |
Arnold Kholodenko, Katrina Mikhaylichenko, Cheng-Yu Lin, Leon Ginzburg, Mark Kawaguchi |
2012-11-27 |
$4,192,000 |
| 8277675 |
Method of damaged low-k dielectric film layer removal |
Seokmin Yun, Seong Hwan Cho, Shrikant Lohokare, John M. de Larios, Stephan Hoffmann |
2012-10-02 |
$5,310,000 |
| 8127395 |
Apparatus for isolated bevel edge clean and method for using the same |
Hyungsuk Alexander Yoon, Andrew D. Bailey, III, Jason A. Ryder, Jeffrey G. Gasparitsch, Randy Johnson +1 more |
2012-03-06 |
$8,631,000 |
| 8105441 |
Carrier for reducing entrance and/or exit marks left by a substrate-processing meniscus |
Robert O'Donnell, Eric H. Lenz, Mike Ravkin, Alexander A. Yatskar |
2012-01-31 |
$12,293,000 |
| 8021512 |
Method of preventing premature drying |
Seokmin Yun |
2011-09-20 |
$16,399,000 |
| 7946303 |
Carrier for reducing entrance and/or exit marks left by a substrate-processing meniscus |
Robert O'Donnell, Eric H. Lenz, Mike Ravkin, Alexander A. Yatskar |
2011-05-24 |
$18,421,000 |
| 7939139 |
Methods for atomic layer deposition (ALD) using a proximity meniscus |
Mike Ravkin, Mikhail Korolik |
2011-05-10 |
$9,663,000 |
| 7849554 |
Apparatus and system for cleaning substrate |
Cheng-Yu Lin, Mark Kawaguchi, Russell Martin, Leon Ginzburg |
2010-12-14 |
$13,033,000 |
| 7758404 |
Apparatus for cleaning edge of substrate and method for using the same |
Jason A. Ryder, Ji Zhu, Fritz Redeker, John Parks, Charles N. Ditmore +1 more |
2010-07-20 |
$11,538,000 |
| 7632376 |
Method and apparatus for atomic layer deposition (ALD) in a proximity system |
Mike Ravkin, Mikhail Korolik |
2009-12-15 |
$22,060,000 |
| 7597765 |
Post etch wafer surface cleaning with liquid meniscus |
Ji Zhu, Seokmin Yun, John M. de Larios |
2009-10-06 |
$9,438,000 |
| 7568488 |
Enhanced wafer cleaning method |
Seokmin Yun, John M. Boyd, John deLarios |
2009-08-04 |
$21,409,000 |
| 7347915 |
Plasma in-situ treatment of chemically amplified resist |
Douglas Keil, Wan-Lin Chen, Eric A. Hudson, S. M. Reza Sadjadi, Andrew D. Bailey, III |
2008-03-25 |
$32,650,000 |
