Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062524 | Plasma reactor having a variable coupling of low frequency RF power to an annular electrode | Kui Zhao, Tuqiang Ni | 2024-08-13 |
| 11371141 | Plasma process apparatus with low particle contamination and method of operating the same | Tuqiang Ni, Rason Zuo, Xingjian CHEN, Lei Wan | 2022-06-28 |
| 11348763 | Corrosion-resistant structure for a gas delivery system in a plasma processing apparatus | Zengdi Lian, Rason Zuo, Dee H. Wu, Yu Guan, Xingjian CHEN +1 more | 2022-05-31 |
| 9466502 | Line width roughness improvement with noble gas plasma | Shih-Yuan Cheng, Youn Gi Hong, Qian Fu | 2016-10-11 |
| 9263284 | Line width roughness improvement with noble gas plasma | Shih-Yuan Cheng, Youn Gi Hong, Qian Fu | 2016-02-16 |
| 8901004 | Plasma etch method to reduce micro-loading | Tom A. Kamp, Qian Fu, I. C. Jang, Linda Braly | 2014-12-02 |
| 8753804 | Line width roughness improvement with noble gas plasma | Shih-Yuan Cheng, Youn Gi Hong, Qian Fu | 2014-06-17 |
| 8609546 | Pulsed bias plasma process to control microloading | Wonchul Lee, Qian Fu, Bryan Pu | 2013-12-17 |
| 8585844 | Extending lifetime of yttrium oxide as a plasma chamber material | Hong Shih, Duane Outka, John Daugherty | 2013-11-19 |
| 8518282 | Method of controlling etch microloading for a tungsten-containing layer | Wonchul Lee, Qian Fu, Bryan Pu | 2013-08-27 |
| 8440573 | Method and apparatus for pattern collapse free wet processing of semiconductor devices | Katrina Mikhaylichenko, Denis Syomin, Qian Fu, Glenn W. Gale, Mark Wilcoxson | 2013-05-14 |
| 8124538 | Selective etch of high-k dielectric material | In Deog BAE, Qian Fu, Wonchul Lee | 2012-02-28 |
| 8097105 | Extending lifetime of yttrium oxide as a plasma chamber material | Hong Shih, Duane Outka, John Daugherty | 2012-01-17 |
| 7682979 | Phase change alloy etch | Qian Fu, Linda Fung-Ming Lee | 2010-03-23 |
| 7629255 | Method for reducing microloading in etching high aspect ratio structures | Qian Fu, Wonchul Lee, Bryan Pu | 2009-12-08 |
| 7413992 | Tungsten silicide etch process with reduced etch rate micro-loading | Sok Tan, Harmeet Singh, Sam Do Lee, Linda Fung-Ming Lee | 2008-08-19 |
| 7208420 | Method for selectively etching an aluminum containing layer | Zhigang Mao | 2007-04-24 |
| 6774045 | Residual halogen reduction with microwave stripper | Gregory J. Goldspring | 2004-08-10 |