| 12237203 |
System, method, and user interface for edge ring wear compensation |
Carlos Leal-Verdugo |
2025-02-25 |
| 12087561 |
Vacuum pump protection against deposition byproduct buildup |
John Drewery, Haoquan Yan, John Daugherty, Ali Sucipto Tan, Ming-Kuei Tseng +1 more |
2024-09-10 |
| 11710623 |
Vacuum pump protection against deposition byproduct buildup |
John Drewery, Haoquan Yan, John Daugherty, Ali Sucipto Tan, Ming-Kuei Tseng +1 more |
2023-07-25 |
| 11538713 |
System and method for edge ring wear compensation |
Carlos Leal-Verdugo |
2022-12-27 |
| 11031215 |
Vacuum pump protection against deposition byproduct buildup |
John Drewery, Haoquan Yan, John Daugherty, Ali Sucipto Tan, Ming-Kuei Tseng +1 more |
2021-06-08 |
| 10950454 |
Integrated atomic layer passivation in TCP etch chamber and in-situ etch-ALP method |
Xiang Zhou, Yoshie Kimura, Duming Zhang, Chen Xu, John Drewery +1 more |
2021-03-16 |
| 10714354 |
Self limiting lateral atomic layer etch |
Neema Rastgar, Michael Carl Drymon |
2020-07-14 |
| 10600648 |
Silicon-based deposition for semiconductor processing |
Mirzafer Abatchev |
2020-03-24 |
| 10431426 |
Gas plenum arrangement for improving etch non-uniformity in transformer-coupled plasma systems |
Arthur H. Sato, Alex Paterson |
2019-10-01 |
| 10163610 |
Extreme edge sheath and wafer profile tuning through edge-localized ion trajectory control and plasma operation |
Saravanapriyan Sriraman, Alexander Paterson |
2018-12-25 |
| 9711359 |
Shadow trim line edge roughness reduction |
Rodolfo P. Belen |
2017-07-18 |
| 9620376 |
Self limiting lateral atomic layer etch |
Neema Rastgar, Michael Carl Drymon |
2017-04-11 |
| 9484214 |
Systems and methods for improving wafer etch non-uniformity when using transformer-coupled plasma |
Arthur H. Sato, Alex Paterson |
2016-11-01 |
| 9396961 |
Integrated etch/clean for dielectric etch applications |
Reza Arghavani, Shashank Deshmukh, Eric A. Hudson, Samantha Tan, Gerardo Delgadino |
2016-07-19 |
| 9012243 |
Controlling CD and CD uniformity with trim time and temperature on a wafer by wafer basis |
Yoshie Kimura, Eric A. Pape, Rohit DeshPande, Keith Gaff, Gowri Kamarthy |
2015-04-21 |
| 8901004 |
Plasma etch method to reduce micro-loading |
Qian Fu, I. C. Jang, Linda Braly, Shenjian Liu |
2014-12-02 |
| 8852964 |
Controlling CD and CD uniformity with trim time and temperature on a wafer by wafer basis |
Yoshie Kimura, Eric A. Pape, Rohit DeshPande, Keith Gaff, Gowri Kamarthy |
2014-10-07 |
| 8124540 |
Hardmask trim method |
— |
2012-02-28 |
| 7851369 |
Hardmask trim method |
— |
2010-12-14 |
| 6939811 |
Apparatus and method for controlling etch depth |
Alan J. Miller, Vijayakumar C. Venugopal |
2005-09-06 |
| 6921724 |
Variable temperature processes for tunable electrostatic chuck |
Richard A. Gottscho, Steve Lee, Chris Lee, Yoko Yamaguchi, Vahid Vahedi +1 more |
2005-07-26 |
