Issued Patents All Time
Showing 1–25 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12127486 | Resistive random access memory with preformed filaments | Thorsten Lill, Yang Pan | 2024-10-22 |
| 11923189 | Capping layer for a hafnium oxide-based ferroelectric material | Zhongwei Zhu | 2024-03-05 |
| 11923404 | Modifying ferroelectric properties of hafnium oxide with hafnium nitride layers | Zhongwei Zhu | 2024-03-05 |
| 10535514 | Method of sealing open pores on surface of porous dielectric material using iCVD process | Byung Jin Cho, Sung Gap Im, Seong Jun Yoon, Kwanyong Pak | 2020-01-14 |
| 9911660 | Methods for forming germanium and silicon germanium nanowire devices | Zhongwei Zhu | 2018-03-06 |
| 9472675 | Method of manufacturing n-doped graphene and electrical component using NH4F, and graphene and electrical component thereby | Byung Jin Cho, Jae Hoon Bong, Onejae Sul | 2016-10-18 |
| 9359673 | Apparatus and method for atomic layer deposition | Mikhail Korolik, Fritz Redeker, John M. Boyd, Yezdi Dordi | 2016-06-07 |
| 9117860 | Controlled ambient system for interface engineering | John M. Boyd, Yezdi Dordi, Tiruchirapalli Arunagiri, Benjamin W. Mooring, John Parks +7 more | 2015-08-25 |
| 8926789 | Apparatus for the removal of a fluorinated polymer from a substrate | John M. Boyd, Andras Kuthi, Andrew D. Bailey, III | 2015-01-06 |
| 8916232 | Method for barrier interface preparation of copper interconnect | John M. Boyd, Yezdi Dordi, Fritz Redeker | 2014-12-23 |
| 8883027 | Methods for removing a metal oxide from a substrate | William Thie, Yezdi Dordi, Andrew D. Bailey, III | 2014-11-11 |
| 8673779 | Interconnect with self-formed barrier | William T. Lee | 2014-03-18 |
| 8673769 | Methods and apparatuses for three dimensional integrated circuits | John M. Boyd, Fritz Redeker, Yezdi Dordi, Shijian Li | 2014-03-18 |
| 8623456 | Methods for atomic layer deposition | Mikhail Korolik, Fritz Redeker, John M. Boyd, Yezdi Dordi | 2014-01-07 |
| 8519461 | Device with post-contact back end of line through-hole via integration | John M. Boyd, Fritz Redeker, Yezdi Dordi, Shijian Li | 2013-08-27 |
| 8323460 | Methods and systems for three-dimensional integrated circuit through hole via gapfill and overburden removal | John M. Boyd, Fritz Redeker, Yezdi Dordi, Shijian Li | 2012-12-04 |
| 8298433 | Methods for removing an edge polymer from a substrate | Yunsang Kim, Jason A. Ryder, Andrew D. Bailey, III | 2012-10-30 |
| 8287647 | Apparatus and method for atomic layer deposition | Mikhail Korolik, Fritz Redeker, John M. Boyd, Yezdi Dordi | 2012-10-16 |
| 8241701 | Processes and systems for engineering a barrier surface for copper deposition | Yezdi Dordi, John M. Boyd, Tiruchirapalli Arunagiri, Fritz Redeker, William Thie +1 more | 2012-08-14 |
| 8187968 | Methods of post-contact back end of line through-hole via integration | John M. Boyd, Fritz Redeker, Yezdi Dordi, Shijian Li | 2012-05-29 |
| 8127395 | Apparatus for isolated bevel edge clean and method for using the same | Andrew D. Bailey, III, Jason A. Ryder, Mark Wilcoxson, Jeffrey G. Gasparitsch, Randy Johnson +1 more | 2012-03-06 |
| 8058164 | Methods of fabricating electronic devices using direct copper plating | Fritz Redecker | 2011-11-15 |
| 8053355 | Methods and systems for low interfacial oxide contact between barrier and copper metallization | Fritz Redeker, John M. Boyd, Yezdi Dordi, Shijian Li | 2011-11-08 |
| 8026605 | Interconnect structure and method of manufacturing a damascene structure | Yezdi Dordi, John M. Boyd, Fritz Redeker, William Thie, Tiruchirapalli Arunagiri | 2011-09-27 |
| 7863179 | Methods of fabricating a barrier layer with varying composition for copper metallization | Fritz Redeker | 2011-01-04 |