Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9287110 | Method and apparatus for wafer electroless plating | William Thie, John M. Boyd, Fritz Redeker, Yezdi Dordi, John Parks +5 more | 2016-03-15 |
| 9117860 | Controlled ambient system for interface engineering | John M. Boyd, Yezdi Dordi, Benjamin W. Mooring, John Parks, William Thie +7 more | 2015-08-25 |
| 8844461 | Fluid handling system for wafer electroless plating and associated methods | William Thie, John M. Boyd, Fritz Redeker, Yezdi Dordi, John Parks +5 more | 2014-09-30 |
| 8790465 | Post-deposition cleaning methods for substrates with cap layers | Artur Kolics, Shijian Li, William Thie | 2014-07-29 |
| 8771804 | Processes and systems for engineering a copper surface for selective metal deposition | Yezdi Dordi, John M. Boyd, Fritz Redeker, William Thie, Arthur M. Howald | 2014-07-08 |
| 8747960 | Processes and systems for engineering a silicon-type surface for selective metal deposition to form a metal silicide | Yezdi Dordi, John M. Boyd, Johan VERTOMMEN, Fritz Redeker, William Thie +1 more | 2014-06-10 |
| 8551575 | Methods and solutions for preventing the formation of metal particulate defect matter upon a substrate after a plating process | Shijian Li, Artur Kolics | 2013-10-08 |
| 8485120 | Method and apparatus for wafer electroless plating | William Thie, John M. Boyd, Fritz Redeker, Yezdi Dordi, John Parks +5 more | 2013-07-16 |
| 8404626 | Post-deposition cleaning methods and formulations for substrates with cap layers | Artur Kolics, Shijian Li, William Thie | 2013-03-26 |
| 8314027 | Wafer electroless plating system and associated methods | William Thie, John M. Boyd, Fritz Redeker, Yezdi Dordi, John Parks +5 more | 2012-11-20 |
| 8241701 | Processes and systems for engineering a barrier surface for copper deposition | Yezdi Dordi, John M. Boyd, Hyungsuk Alexander Yoon, Fritz Redeker, William Thie +1 more | 2012-08-14 |
| 8133812 | Methods and systems for barrier layer surface passivation | Yezdi Dordi, John M. Boyd, Fritz Redeker, William Thie, Alex Yoon | 2012-03-13 |
| 8069813 | Wafer electroless plating system and associated methods | William Thie, John M. Boyd, Fritz Redeker, Yezdi Dordi, John Parks +5 more | 2011-12-06 |
| 8026605 | Interconnect structure and method of manufacturing a damascene structure | Yezdi Dordi, John M. Boyd, Fritz Redeker, William Thie, Hyungsuk Alexander Yoon | 2011-09-27 |
| 7884017 | Thermal methods for cleaning post-CMP wafers | Zhonghui Wang, Fritz Redeker, Yezdi Dordi, John M. Boyd, Mikhail Korolik +3 more | 2011-02-08 |
| 7709400 | Thermal methods for cleaning post-CMP wafers | Zhonghui Wang, Fritz Redeker, Yezdi Dordi, John M. Boyd, Mikhail Korolik +3 more | 2010-05-04 |
| 7592259 | Methods and systems for barrier layer surface passivation | Yezdi Dordi, John M. Boyd, Fritz Redeker, William Thie, Alex Yoon | 2009-09-22 |