WT

William Thie

Lam Research: 33 patents #64 of 2,128Top 4%
Overall (All Time): #108,147 of 4,157,543Top 3%
33
Patents All Time

Issued Patents All Time

Showing 25 most recent of 33 patents

Patent #TitleCo-InventorsDate
9997364 High aspect ratio etch Jisoo Kim 2018-06-12
9287110 Method and apparatus for wafer electroless plating John M. Boyd, Fritz Redeker, Yezdi Dordi, John Parks, Tiruchirapalli Arunagiri +5 more 2016-03-15
9117860 Controlled ambient system for interface engineering John M. Boyd, Yezdi Dordi, Tiruchirapalli Arunagiri, Benjamin W. Mooring, John Parks +7 more 2015-08-25
8883027 Methods for removing a metal oxide from a substrate Hyungsuk Alexander Yoon, Yezdi Dordi, Andrew D. Bailey, III 2014-11-11
8844461 Fluid handling system for wafer electroless plating and associated methods John M. Boyd, Fritz Redeker, Yezdi Dordi, John Parks, Tiruchirapalli Arunagiri +5 more 2014-09-30
8790465 Post-deposition cleaning methods for substrates with cap layers Artur Kolics, Shijian Li, Tiruchirapalli Arunagiri 2014-07-29
8771804 Processes and systems for engineering a copper surface for selective metal deposition Yezdi Dordi, John M. Boyd, Tiruchirapalli Arunagiri, Fritz Redeker, Arthur M. Howald 2014-07-08
8747960 Processes and systems for engineering a silicon-type surface for selective metal deposition to form a metal silicide Yezdi Dordi, John M. Boyd, Tiruchirapalli Arunagiri, Johan VERTOMMEN, Fritz Redeker +1 more 2014-06-10
8691698 Controlled gas mixing for smooth sidewall rapid alternating etch process Qing Xu, Camelia Rusu 2014-04-08
8622020 Simultaneous electroless plating of two substrates John M. Boyd, Yezdi Dordi, Fritz Redeker 2014-01-07
8603913 Porous dielectrics K value restoration by thermal treatment and or solvent treatment Nanhai Li, Novy Tjokro, Yaxin Wang, Artur Kolics 2013-12-10
8490573 Method and apparatus for material deposition Yezdi Dordi, John M. Boyd, Bob Maraschin, Fred C. Redeker, Joel M. Cook 2013-07-23
8485120 Method and apparatus for wafer electroless plating John M. Boyd, Fritz Redeker, Yezdi Dordi, John Parks, Tiruchirapalli Arunagiri +5 more 2013-07-16
8404626 Post-deposition cleaning methods and formulations for substrates with cap layers Artur Kolics, Shijian Li, Tiruchirapalli Arunagiri 2013-03-26
8314027 Wafer electroless plating system and associated methods John M. Boyd, Fritz Redeker, Yezdi Dordi, John Parks, Tiruchirapalli Arunagiri +5 more 2012-11-20
8241701 Processes and systems for engineering a barrier surface for copper deposition Yezdi Dordi, John M. Boyd, Tiruchirapalli Arunagiri, Hyungsuk Alexander Yoon, Fritz Redeker +1 more 2012-08-14
8133812 Methods and systems for barrier layer surface passivation Yezdi Dordi, John M. Boyd, Fritz Redeker, Tiruchirapalli Arunagiri, Alex Yoon 2012-03-13
8069813 Wafer electroless plating system and associated methods John M. Boyd, Fritz Redeker, Yezdi Dordi, John Parks, Tiruchirapalli Arunagiri +5 more 2011-12-06
8026605 Interconnect structure and method of manufacturing a damascene structure Yezdi Dordi, John M. Boyd, Fritz Redeker, Tiruchirapalli Arunagiri, Hyungsuk Alexander Yoon 2011-09-27
7909934 Megasonic cleaning efficiency using auto-tuning of a RF generator at constant maximum efficiency John M. Boyd, Andras Kuthi, Michael G. R. Smith, Thomas W. Anderson 2011-03-22
7884017 Thermal methods for cleaning post-CMP wafers Zhonghui Wang, Tiruchirapalli Arunagiri, Fritz Redeker, Yezdi Dordi, John M. Boyd +3 more 2011-02-08
7875554 Method for electroless depositing a material on a surface of a wafer Yezdi Dordi, John M. Boyd, Bob Maraschin, Fred C. Redeker, Joel M. Cook 2011-01-25
7829152 Electroless plating method and apparatus John M. Boyd, Yezdi Dordi, Fritz Redeker 2010-11-09
7752996 Apparatus for applying a plating solution for electroless deposition Yezdi Dordi, John M. Boyd, Fritz Redeker, Aleksander Owczarz 2010-07-13
7709400 Thermal methods for cleaning post-CMP wafers Zhonghui Wang, Tiruchirapalli Arunagiri, Fritz Redeker, Yezdi Dordi, John M. Boyd +3 more 2010-05-04