YW

Yaxin Wang

Applied Materials: 18 patents #731 of 7,310Top 10%
NF Nobell Foods: 4 patents #4 of 5Top 80%
Lam Research: 4 patents #662 of 2,128Top 35%
Xiaomi: 2 patents #424 of 1,395Top 35%
Huawei: 2 patents #5,439 of 15,535Top 40%
Overall (All Time): #115,109 of 4,157,543Top 3%
31
Patents All Time

Issued Patents All Time

Showing 25 most recent of 31 patents

Patent #TitleCo-InventorsDate
12405715 Page display method, electronic device and storage medium 2025-09-02
12401975 Communication method, apparatus, and system Haiyang Sun, Fangyuan Zhu 2025-08-26
12241109 Host cells comprising a recombinant casein protein and a recombinant kinase protein Viviane Lanquar, Magi EL-RICHANI, Leyla HATHWAIK 2025-03-04
D1060619 Inflatable ice bath tub 2025-02-04
12148506 Compositions and methods for expressing genes of interest in host cells Viviane Lanquar, Leyla HATHWAIK 2024-11-19
12139737 Host cells comprising a recombinant casein protein and a recombinant kinase protein Viviane Lanquar, Magi EL-RICHANI, Leyla HATHWAIK 2024-11-12
11979247 Message forwarding method and apparatus Yan Li 2024-05-07
11847305 Page display method, electronic device and storage medium 2023-12-19
11840717 Host cells comprising a recombinant casein protein and a recombinant kinase protein Viviane Lanquar, Magi EL-RICHANI, Leyla HATHWAIK 2023-12-12
9818617 Method of electroless plating using a solution with at least two borane containing reducing agents Artur Kolics, Praveen Nalla, Xiaomin Bin, Nanhai Li, Patrick William Little +1 more 2017-11-14
9551074 Electroless plating solution with at least two borane containing reducing agents Artur Kolics, Praveen Nalla, Xiaomin Bin, Nanhai Li, Patrick William Little +1 more 2017-01-24
9142416 Process to reduce nodule formation in electroless plating Nanhai Li, Xiaomin Bin, Marina Polyanskaya, Novy Tjokro, Artur Kolics 2015-09-22
8603913 Porous dielectrics K value restoration by thermal treatment and or solvent treatment Nanhai Li, William Thie, Novy Tjokro, Artur Kolics 2013-12-10
7910476 Adhesion and minimizing oxidation on electroless CO alloy films for integration with low K inter-metal dielectric and etch stop Hongbin Fang, Timothy Weidman, Fang Mei, Arulkumar Shanmugasundram, Christopher Dennis Bencher +1 more 2011-03-22
7542132 Raman spectroscopy as integrated chemical metrology Hongbin Fang, Josh H. Golden, Timothy Weidman, Arulkumar Shanmugasundram 2009-06-02
7473655 Method for silicon based dielectric chemical vapor deposition Yuji Maeda, Thomas C. Mele, Sean M. Seutter, Sanjeev Tandon, R. Suryanarayanan Iyer 2009-01-06
7413627 Deposition chamber and method for depositing low dielectric constant films Shijian Li, Fred C. Redeker, Tetsuya Ishikawa, Alan W. Collins 2008-08-19
6833052 Deposition chamber and method for depositing low dielectric constant films Shijian Li, Fred C. Redeker, Tetsuya Ishikawa, Alan W. Collins 2004-12-21
6814814 Cleaning residues from surfaces in a chamber by sputtering sacrificial substrates Alan W. Collins, Feng Gao, Tetsuya Ishikawa, Padmanaban Krishnaraj 2004-11-09
6624064 Chamber seasoning method to improve adhesion of F-containing dielectric film to metal for VLSI application Turgut Sahin, Ming Xi 2003-09-23
6589610 Deposition chamber and method for depositing low dielectric constant films Shijian Li, Fred C. Redeker, Tetsuya Ishikawa, Alan W. Collins 2003-07-08
6511923 Deposition of stable dielectric films Michael Barnes, Thanh Pham, Farhad Moghadam 2003-01-28
6479100 CVD ruthenium seed for CVD ruthenium deposition Xiaoliang Jin, Christopher Wade, Xianzhi Tao, Elaine Pao, Jun Zhao 2002-11-12
6475854 Method of forming metal electrodes Pravin K. Narwankar, Annabel Nickles, Xiaoliang Jin, Deepak Upadhyaya 2002-11-05
6440495 Chemical vapor deposition of ruthenium films for metal electrode applications Christopher Wade, Elaine Pao, Jun Zhao 2002-08-27