Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12203168 | Metal deposition | Ravi Vellanki, Eric H. Lenz, Vinayakaraddy Gulabal, Sanjay Gopinath, Michal Danek +5 more | 2025-01-21 |
| 12077858 | Tungsten deposition | Pragna Nannapaneni, Sema Ermez, Ruopeng Deng, Tianhua Yu, Xiaolan Ba +1 more | 2024-09-03 |
| 12060639 | Rapid flush purging during atomic layer deposition | Pragna Nannapaneni, Sema Ermez, Ruopeng Deng, Tianhua Yu, Xiaolan Ba +2 more | 2024-08-13 |
| 10103056 | Methods for wet metal seed deposition for bottom up gapfill of features | Samantha Tan, Boris Volosskiy, Taeseung Kim, Praveen Nalla, Artur Kolics | 2018-10-16 |
| 9837312 | Atomic layer etching for enhanced bottom-up feature fill | Samantha Tan, Taeseung Kim, Jengyi Yu, Praveen Nalla, Artur Kolics +1 more | 2017-12-05 |
| 9142416 | Process to reduce nodule formation in electroless plating | Nanhai Li, Xiaomin Bin, Yaxin Wang, Marina Polyanskaya, Artur Kolics | 2015-09-22 |
| 9029258 | Through silicon via metallization | Praveen Nalla, Artur Kolics, Seshasayee Varadarajan | 2015-05-12 |
| 8603913 | Porous dielectrics K value restoration by thermal treatment and or solvent treatment | Nanhai Li, William Thie, Yaxin Wang, Artur Kolics | 2013-12-10 |