Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818617 | Method of electroless plating using a solution with at least two borane containing reducing agents | Artur Kolics, Praveen Nalla, Xiaomin Bin, Nanhai Li, Yaxin Wang +1 more | 2017-11-14 |
| 9551074 | Electroless plating solution with at least two borane containing reducing agents | Artur Kolics, Praveen Nalla, Xiaomin Bin, Nanhai Li, Yaxin Wang +1 more | 2017-01-24 |
| 9142416 | Process to reduce nodule formation in electroless plating | Nanhai Li, Xiaomin Bin, Yaxin Wang, Novy Tjokro, Artur Kolics | 2015-09-22 |
| 7772128 | Semiconductor system with surface modification | Artur Kolics, Nanhai Li, Mark K. Weise, Jason Stephen Corneille | 2010-08-10 |