Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362188 | Method for preventing line bending during metal fill process | Adam Jandl, Lawrence Schloss, Sanjay Gopinath, Michal Danek, Siew Neo +2 more | 2025-07-15 |
| 12237221 | Nucleation-free tungsten deposition | Ruopeng Deng, Yutaka Nishioka, Xiaolan Ba, Sanjay Gopinath, Michal Danek | 2025-02-25 |
| 12077858 | Tungsten deposition | Pragna Nannapaneni, Novy Tjokro, Ruopeng Deng, Tianhua Yu, Xiaolan Ba +1 more | 2024-09-03 |
| 12060639 | Rapid flush purging during atomic layer deposition | Pragna Nannapaneni, Novy Tjokro, Ruopeng Deng, Tianhua Yu, Xiaolan Ba +2 more | 2024-08-13 |
| 11355345 | Method for preventing line bending during metal fill process | Adam Jandl, Lawrence Schloss, Sanjay Gopinath, Michal Danek, Siew Neo +2 more | 2022-06-07 |
| 10573522 | Method for preventing line bending during metal fill process | Adam Jandl, Lawrence Schloss, Sanjay Gopinath, Michal Danek, Siew Neo +2 more | 2020-02-25 |