Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237221 | Nucleation-free tungsten deposition | Sema Ermez, Ruopeng Deng, Yutaka Nishioka, Sanjay Gopinath, Michal Danek | 2025-02-25 |
| 12077858 | Tungsten deposition | Pragna Nannapaneni, Novy Tjokro, Sema Ermez, Ruopeng Deng, Tianhua Yu +1 more | 2024-09-03 |
| 12060639 | Rapid flush purging during atomic layer deposition | Pragna Nannapaneni, Sema Ermez, Novy Tjokro, Ruopeng Deng, Tianhua Yu +2 more | 2024-08-13 |
| 12014928 | Multi-layer feature fill | Ruopeng Deng, Juwen Gao, Sanjay Gopinath, Lawrence Schloss | 2024-06-18 |
| 11972952 | Atomic layer deposition on 3D NAND structures | Ruopeng Deng, Tianhua Yu, Yu-Hao Pan, Juwen Gao | 2024-04-30 |
| 10546751 | Forming low resistivity fluorine free tungsten film without nucleation | Hanna Bamnolker, Joshua Collins, Tomas Sadilek, Hyeong Seop Shin, Raashina Humayun +2 more | 2020-01-28 |
| 9978605 | Method of forming low resistivity fluorine free tungsten film without nucleation | Hanna Bamnolker, Joshua Collins, Tomas Sadilek, Hyeong Seop Shin, Raashina Humayun +2 more | 2018-05-22 |
| 9754824 | Tungsten films having low fluorine content | Lawrence Schloss | 2017-09-05 |
| 9633861 | Cu/barrier interface enhancement | Weifeng YE, Mei-Yee Shek, Mihaela Balseanu, Xiaojun Zhang, Yu Jin +1 more | 2017-04-25 |
| 9613818 | Deposition of low fluorine tungsten by sequential CVD process | Raashina Humayun, Michal Danek, Lawrence Schloss | 2017-04-04 |
| 9580801 | Enhancing electrical property and UV compatibility of ultrathin blok barrier film | Weifeng YE, Mei-Yee Shek, Yu Jin, Li-Qun Xia, Deenesh Padhi +1 more | 2017-02-28 |