Issued Patents All Time
Showing 25 most recent of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12060639 | Rapid flush purging during atomic layer deposition | Pragna Nannapaneni, Sema Ermez, Novy Tjokro, Ruopeng Deng, Tianhua Yu +2 more | 2024-08-13 |
| 12014928 | Multi-layer feature fill | Xiaolan Ba, Ruopeng Deng, Sanjay Gopinath, Lawrence Schloss | 2024-06-18 |
| 11972952 | Atomic layer deposition on 3D NAND structures | Ruopeng Deng, Xiaolan Ba, Tianhua Yu, Yu-Hao Pan | 2024-04-30 |
| 11901227 | Feature fill with nucleation inhibition | Anand Chandrashekar, Esther Jeng, Raashina Humayun, Michal Danek, Deqi Wang | 2024-02-13 |
| 11670516 | Metal-containing passivation for high aspect ratio etch | Karthik S. Colinjivadi, Samantha Tan, Shih-Ked Lee, George Matamis, Yongsik Yu +4 more | 2023-06-06 |
| 11410883 | Tungsten feature fill with nucleation inhibition | Anand Chandrashekar, Esther Jeng, Raashina Humayun, Michal Danek, Deqi Wang | 2022-08-09 |
| 11348795 | Metal fill process for three-dimensional vertical NAND wordline | Lawrence Schloss, Raashina Humayun, Sanjay Gopinath, Michal Danek, Kaihan Ashtiani | 2022-05-31 |
| 11075115 | Tungsten feature fill | Anand Chandrashekar, Esther Jeng, Raashina Humayun, Michal Danek, Deqi Wang | 2021-07-27 |
| 10580695 | Feature fill with nucleation inhibition | Anand Chandrashekar, Esther Jeng, Raashina Humayun, Michal Danek, Deqi Wang | 2020-03-03 |
| 10529722 | Tungsten for wordline applications | Michal Danek, Hanna Bamnolker, Raashina Humayun | 2020-01-07 |
| 10256142 | Tungsten feature fill with nucleation inhibition | Anand Chandrashekar, Esther Jeng, Raashina Humayun, Michal Danek, Deqi Wang | 2019-04-09 |
| 10103058 | Tungsten feature fill | Anand Chandrashekar, Esther Jeng, Raashina Humayun, Michal Danek, Deqi Wang | 2018-10-16 |
| 9997405 | Feature fill with nucleation inhibition | Anand Chandrashekar, Esther Jeng, Raashina Humayun, Michal Danek, Deqi Wang | 2018-06-12 |
| 9969622 | Ternary tungsten boride nitride films and methods for forming same | Wei Lei | 2018-05-15 |
| 9953984 | Tungsten for wordline applications | Michal Danek, Hanna Bamnolker, Raashina Humayun | 2018-04-24 |
| 9653353 | Tungsten feature fill | Anand Chandrashekar, Esther Jeng, Raashina Humayun, Michal Danek, Deqi Wang | 2017-05-16 |
| 9595470 | Methods of preparing tungsten and tungsten nitride thin films using tungsten chloride precursor | Hanna Bamnolker, Raashina Humayun, Michal Danek, Joshua Collins | 2017-03-14 |
| 9362163 | Methods and apparatuses for atomic layer cleaning of contacts and vias | Michal Danek, Aaron R. Fellis, Francisco Juarez, Chiukin Steven Lai | 2016-06-07 |
| 9240347 | Tungsten feature fill | Anand Chandrashekar, Esther Jeng, Raashina Humayun, Michal Danek, Deqi Wang | 2016-01-19 |
| 9034760 | Methods of forming tensile tungsten films and compressive tungsten films | Feng Chen, Tsung-Han Yang, Roey Shaviv, Raashina Humayun, Deqi Wang | 2015-05-19 |
| 8975184 | Methods of improving tungsten contact resistance in small critical dimension features | Feng Chen, Tsung-Han Yang, Michal Danek | 2015-03-10 |
| 8778797 | Systems and methods for selective tungsten deposition in vias | Rajkumar Jakkaraju, Michal Danek, Wei Lei | 2014-07-15 |
| 8709948 | Tungsten barrier and seed for copper filled TSV | Michal Danek, Tom Mountsier, Jonathan D. Reid, Aaron R. Fellis | 2014-04-29 |
| 8617982 | Subtractive patterning to define circuit components | Michal Danek, Ronald A. Powell, Aaron R. Fellis | 2013-12-31 |
| 8207062 | Method for improving adhesion of low resistivity tungsten/tungsten nitride layers | Wei Lei, Michal Danek, Erich R. Klawuhn, Sean Chang, Ron Powell | 2012-06-26 |