Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9673146 | Low temperature tungsten film deposition for small critical dimension contacts and interconnects | Raashina Humayun, Michal Danek, Anand Chandrashekar | 2017-06-06 |
| 9236297 | Low tempature tungsten film deposition for small critical dimension contacts and interconnects | Raashina Humayun, Michal Danek, Anand Chandrashekar | 2016-01-12 |
| 9034760 | Methods of forming tensile tungsten films and compressive tungsten films | Tsung-Han Yang, Juwen Gao, Roey Shaviv, Raashina Humayun, Deqi Wang | 2015-05-19 |
| 8975184 | Methods of improving tungsten contact resistance in small critical dimension features | Tsung-Han Yang, Juwen Gao, Michal Danek | 2015-03-10 |
| 8853080 | Method for depositing tungsten film with low roughness and low resistivity | Yan Guan, Abhishek Manohar, Deqi Wang, Raashina Humayun | 2014-10-07 |
| 8623733 | Methods for depositing ultra thin low resistivity tungsten film for small critical dimension contacts and interconnects | Raashina Humayun, Michal Danek, Anand Chandrashekar | 2014-01-07 |
| 8551885 | Method for reducing tungsten roughness and improving reflectivity | Raashina Humayun, Abhishek Manohar | 2013-10-08 |
| 8409987 | Method for depositing thin tungsten film with low resistivity and robust micro-adhesion characteristics | Anand Chandrashekar, Mirko Glass, Raashina Humayun, Michal Danek, Kaihan Ashtiani +2 more | 2013-04-02 |
| 8329576 | Method for improving uniformity and adhesion of low resistivity tungsten film | Lana Hiului Chan, Karl B. Levy | 2012-12-11 |
| 8058170 | Method for depositing thin tungsten film with low resistivity and robust micro-adhesion characteristics | Anand Chandrashekar, Mirko Glass, Raashina Humayun, Michael Danek, Kaihan Ashtiani +2 more | 2011-11-15 |
| 7772114 | Method for improving uniformity and adhesion of low resistivity tungsten film | Lana Hiului Chan, Karl B. Levy | 2010-08-10 |
| 7611969 | Generation and applications of negative dielectric constant materials | Ching-Wu Chu, Yu-Yi Xue, Jason Shulman, Stephen Tsui | 2009-11-03 |