Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8367546 | Methods for forming all tungsten contacts and lines | Raashina Humayun, Kaihan Ashtiani | 2013-02-05 |
| 8329576 | Method for improving uniformity and adhesion of low resistivity tungsten film | Lana Hiului Chan, Feng Chen | 2012-12-11 |
| 8192131 | Architecture for high throughput semiconductor processing applications | Craig L. Stevens | 2012-06-05 |
| 8053365 | Methods for forming all tungsten contacts and lines | Raashina Humayun, Kaihan Ashtiani | 2011-11-08 |
| 7772114 | Method for improving uniformity and adhesion of low resistivity tungsten film | Lana Hiului Chan, Feng Chen | 2010-08-10 |
| 7691749 | Deposition of tungsten nitride | Junghwan Sung, Kaihan Ashtiani, James A. Fair, Joshua Collins, Juwen Gao | 2010-04-06 |
| 7262125 | Method of forming low-resistivity tungsten interconnects | Panya Wongsenakhum, Aaron R. Fellis, Kaihan Ashtiani, Juwen Gao, Joshua Collins +2 more | 2007-08-28 |
| 7141494 | Method for reducing tungsten film roughness and improving step coverage | Sang-Hyeob Lee, Aaron R. Fellis, Panya Wongsenakhum, Juwen Gao, Joshua Collins +3 more | 2006-11-28 |
| 7005372 | Deposition of tungsten nitride | Junghwan Sung, Kaihan Ashtiani, James A. Fair, Joshua Collins, Juwen Gao | 2006-02-28 |
| 6977014 | Architecture for high throughput semiconductor processing applications | Craig L. Stevens | 2005-12-20 |
| 6905959 | Apparatus and method for depositing superior Ta (N) copper thin films for barrier and seed applications in semiconductor processing | Kaihan Ashtiani, Maximilian A. Biberger, Erich R. Klawuhn, Kwok Fai Lai, J. Patrick Rymer | 2005-06-14 |
| 6902620 | Atomic layer deposition systems and methods | Thomas R. Omstead | 2005-06-07 |
| 6554914 | Passivation of copper in dual damascene metalization | Robert T. Rozbicki, Ronald A. Powell, Erich R. Klawuhn, Michal Danek, Jonathan D. Reid +2 more | 2003-04-29 |
| 6541371 | Apparatus and method for depositing superior Ta(N)/copper thin films for barrier and seed applications in semiconductor processing | Kaihan Ashtiani, Maximilian A. Biberger, Erich R. Klawuhn, Kwok Fai Lai, J. Patrick Rymer | 2003-04-01 |
| 6534404 | Method of depositing diffusion barrier for copper interconnect in integrated circuit | Michal Danek, Hyoun S. Choe | 2003-03-18 |
| 6500321 | Control of erosion profile and process characteristics in magnetron sputtering by geometrical shaping of the sputtering target | Kaihan Ashtiani, Larry D. Hartsough, Richard S. Hill, Robert Martinson | 2002-12-31 |
| 6497734 | Apparatus and method for enhanced degassing of semiconductor wafers for increased throughput | Kenneth K. Barber, Mark Fissel, Soo Yun Joh, Mukul Khosla, Robert Martinson +2 more | 2002-12-24 |
| 6497796 | Apparatus and method for controlling plasma uniformity across a substrate | Kaihan Ashtiani, Kwok Fai Lai, Andrew L. Nordquist, Larry D. Hartsough | 2002-12-24 |
| 6444105 | Physical vapor deposition reactor including magnet to control flow of ions | Kwok Fai Lai, Andrew L. Nordquist, Kaihan Ashtiani, Larry D. Hartsough | 2002-09-03 |
| 6193854 | Apparatus and method for controlling erosion profile in hollow cathode magnetron sputter source | Kwok Fai Lai, Larry D. Hartsough, Andrew L. Nordquist, Kaihan Ashtiani, Maximilian A. Biberger | 2001-02-27 |
| 6179973 | Apparatus and method for controlling plasma uniformity across a substrate | Kwok Fai Lai, Andrew L. Nordquist, Kaihan Ashtiani, Larry D. Hartsough | 2001-01-30 |
| 5976310 | Plasma etch system | — | 1999-11-02 |
| 5942799 | Multilayer diffusion barriers | Michal Danek | 1999-08-24 |
| 5465154 | Optical monitoring of growth and etch rate of materials | — | 1995-11-07 |
| 5298465 | Plasma etching system | — | 1994-03-29 |