Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11075127 | Suppressing interfacial reactions by varying the wafer temperature throughout deposition | Seshasayee Varadarajan, Andrew John McKerrow, James S. Sims, Ramesh Chandrasekharan, Jon Henri | 2021-07-27 |
| 10347547 | Suppressing interfacial reactions by varying the wafer temperature throughout deposition | Seshasayee Varadarajan, Andrew John McKerrow, James S. Sims, Ramesh Chandrasekharan, Jon Henri | 2019-07-09 |
| 9362163 | Methods and apparatuses for atomic layer cleaning of contacts and vias | Michal Danek, Juwen Gao, Francisco Juarez, Chiukin Steven Lai | 2016-06-07 |
| 9034768 | Depositing tungsten into high aspect ratio features | Anand Chandrashekar, Raashina Humayun, Michal Danek, Sean Chang | 2015-05-19 |
| 8835317 | Depositing tungsten into high aspect ratio features | Anand Chandrashekar, Raashina Humayun, Michal Danek, Sean Chang | 2014-09-16 |
| 8709948 | Tungsten barrier and seed for copper filled TSV | Michal Danek, Tom Mountsier, Jonathan D. Reid, Juwen Gao | 2014-04-29 |
| 8617982 | Subtractive patterning to define circuit components | Michal Danek, Juwen Gao, Ronald A. Powell | 2013-12-31 |
| 8435894 | Depositing tungsten into high aspect ratio features | Anand Chandrashekar, Raashina Humayun, Michal Danek, Sean Chang | 2013-05-07 |
| 8124531 | Depositing tungsten into high aspect ratio features | Anand Chandrashekar, Raashina Humayun, Michal Danek, Sean Chang | 2012-02-28 |
| 8119527 | Depositing tungsten into high aspect ratio features | Anand Chadrashekar, Raashina Humayun, Michal Danek, Sean Chang | 2012-02-21 |
| 7262125 | Method of forming low-resistivity tungsten interconnects | Panya Wongsenakhum, Kaihan Ashtiani, Karl B. Levy, Juwen Gao, Joshua Collins +2 more | 2007-08-28 |
| 7141494 | Method for reducing tungsten film roughness and improving step coverage | Sang-Hyeob Lee, Karl B. Levy, Panya Wongsenakhum, Juwen Gao, Joshua Collins +3 more | 2006-11-28 |