Issued Patents All Time
Showing 1–25 of 106 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12089953 | Systems and methods for utilizing intrinsic current noise to measure interface impedances | Ning Guo | 2024-09-17 |
| 12012667 | Copper electrofill on non-copper liner layers | Lee J. Brogan, Yi Liu | 2024-06-18 |
| 11961494 | Electromagnetic interference reduction in extended reality environments | Ning Guo, Akshay Sunil YEMBARWAR, Daniel Wetmore | 2024-04-16 |
| 11280022 | Removal of electroplating bath additives | Tighe A. Spurlin | 2022-03-22 |
| 11208732 | Monitoring surface oxide on seed layers during electroplating | Ludan Huang, Lee J. Brogan, Tighe A. Spurlin, Shantinath Ghongadi, Manish Ranjan +2 more | 2021-12-28 |
| 11129569 | Shielding techniques for noise reduction in surface electromyography signal measurement and related systems and methods | Ning Guo, Alexandre Barachant | 2021-09-28 |
| 11078591 | Process for optimizing cobalt electrofill using sacrificial oxidants | Lee J. Brogan, Natalia V. Doubina, Matthew A. Rigsby | 2021-08-03 |
| 11045137 | Methods and apparatus for improved signal robustness for a wearable neuromuscular recording device | Curtis Barbre, Ning Guo, Brandon Pool | 2021-06-29 |
| 10745817 | Configuration and method of operation of an electrodeposition system for improved process stability and performance | Kousik Ganesan, Tighe A. Spurlin, Shantinath Ghongadi, Andrew John McKerrow, James E. Duncan | 2020-08-18 |
| 10711366 | Removal of electroplating bath additives | Tighe A. Spurlin | 2020-07-14 |
| 10687759 | Shielding techniques for noise reduction in surface electromyography signal measurement and related systems and methods | Ning Guo, Alexandre Barachant | 2020-06-23 |
| 10472730 | Electrolyte concentration control system for high rate electroplating | Steven T. Mayer, Seshasayee Varadarajan | 2019-11-12 |
| 10443146 | Monitoring surface oxide on seed layers during electroplating | Ludan Huang, Lee J. Brogan, Tighe A. Spurlin, Shantinath Ghongadi, Manish Ranjan +2 more | 2019-10-15 |
| 10358738 | Gap fill process stability monitoring of an electroplating process using a potential-controlled exit step | Quan Ma, Shantinath Ghongadi, Zhian He, Bryan Pennington, Tariq Majid | 2019-07-23 |
| 10329683 | Process for optimizing cobalt electrofill using sacrificial oxidants | Lee J. Brogan, Natalia V. Doubina, Matthew A. Rigsby | 2019-06-25 |
| 10023970 | Dynamic current distribution control apparatus and method for wafer electroplating | Zhian He, David W. Porter, Frederick Dean Wilmot | 2018-07-17 |
| 10006144 | Method and apparatus for filling interconnect structures | Huanfeng Zhu | 2018-06-26 |
| 9865501 | Method and apparatus for remote plasma treatment for reducing metal oxides on a metal seed layer | Tighe A. Spurlin, George Andrew Antonelli, Natalia V. Doubina, James E. Duncan, David W. Porter | 2018-01-09 |
| 9822461 | Dynamic current distribution control apparatus and method for wafer electroplating | Zhian He, David W. Porter, Frederick Dean Wilmot | 2017-11-21 |
| 9816193 | Configuration and method of operation of an electrodeposition system for improved process stability and performance | Kousik Ganesan, Tighe A. Spurlin, Shantinath Ghongadi, Andrew John McKerrow, James E. Duncan | 2017-11-14 |
| 9816196 | Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte | Tighe A. Spurlin, Charles Merrill, Ludan Huang, Matthew Thorum, Lee J. Brogan +9 more | 2017-11-14 |
| 9816194 | Control of electrolyte flow dynamics for uniform electroplating | Zhian He, Jian Zhou, Jingbin Feng, Shantinath Ghongadi | 2017-11-14 |
| 9777386 | Chemistry additives and process for cobalt film electrodeposition | Natalia V. Doubina, Matthew A. Rigsby | 2017-10-03 |
| 9481942 | Geometry and process optimization for ultra-high RPM plating | Jian Zhou, Cian Sweeney, Zhian He | 2016-11-01 |
| 9472377 | Method and apparatus for characterizing metal oxide reduction | Edward C. Opocensky, Tighe A. Spurlin | 2016-10-18 |