Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10006144 | Method and apparatus for filling interconnect structures | Jonathan D. Reid | 2018-06-26 |
| 8703615 | Copper electroplating process for uniform across wafer deposition and void free filling on ruthenium coated wafers | Thomas A. Ponnuswamy, John Sukamto, Jonathan D. Reid, Steven T. Mayer | 2014-04-22 |
| 8575028 | Method and apparatus for filling interconnect structures | Jonathan D. Reid | 2013-11-05 |