Issued Patents All Time
Showing 1–25 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424453 | Low temperature direct copper-copper bonding | Stephen J. Banik, II, Justin Oberst, Kari Thorkelsson, Bryan L. Buckalew | 2025-09-23 |
| 12392047 | Byproduct removal from electroplating solutions | Joseph Richardson, Jae Shin, Jeyavel Velmurugan, Elizabeth Calora, Steven T. Mayer | 2025-08-19 |
| 12305307 | TSV process window and fill performance enhancement by long pulsing and ramping | Jae Shin, Joseph Richardson, Jeyavel Velmurugan, Steven T. Mayer | 2025-05-20 |
| 12293943 | Gold through silicon mask plating | Lee Peng Chua, Defu Liang, Jacob Kurtis Blickensderfer, Bryan L. Buckalew, Steven T. Mayer | 2025-05-06 |
| 11699590 | Copper electrodeposition sequence for the filling of cobalt lined features | Jeyavel Velmurugan, Bryan L. Buckalew | 2023-07-11 |
| 11542630 | Cleaning electroplating substrate holders using reverse current deplating | Lee Peng Chua, Steven T. Mayer, Santosh Kumar | 2023-01-03 |
| 11168407 | Copper electrodeposition on cobalt lined features | Jeyavel Velmurugan, Bryan L. Buckalew | 2021-11-09 |
| 10954605 | Protecting anodes from passivation in alloy plating systems | Lee Peng Chua, Steven T. Mayer, David W. Porter | 2021-03-23 |
| 10930511 | Copper electrodeposition sequence for the filling of cobalt lined features | Jeyavel Velmurugan, Bryan L. Buckalew | 2021-02-23 |
| 10714436 | Systems and methods for achieving uniformity across a redistribution layer | Bryan L. Buckalew, Steven T. Mayer, Stephen J. Banik, II, Justin Oberst | 2020-07-14 |
| 10662545 | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating | Steven T. Mayer, Bryan L. Buckalew, Haiying Fu, Hilton Diaz Camilo, Robert Rash +1 more | 2020-05-26 |
| 10648097 | Copper electrodeposition on cobalt lined features | Jeyavel Velmurugan, Bryan L. Buckalew | 2020-05-12 |
| 10538855 | Cleaning electroplating substrate holders using reverse current deplating | Lee Peng Chua, Steven T. Mayer, Santosh Kumar | 2020-01-21 |
| 10301738 | Methods and apparatus for wetting pretreatment for through resist metal plating | Bryan L. Buckalew, Steven T. Mayer, Robert Rash, Brian Paul Blackman, Doug Higley | 2019-05-28 |
| 10211052 | Systems and methods for fabrication of a redistribution layer to avoid etching of the layer | Bryan L. Buckalew, Stephen J. Banik, II, Joseph Richardson | 2019-02-19 |
| 10190232 | Apparatuses and methods for maintaining pH in nickel electroplating baths | Bryan L. Buckalew, Ben Foley, Steven T. Mayer | 2019-01-29 |
| 10128102 | Methods and apparatus for wetting pretreatment for through resist metal plating | Lee Peng Chua, Bryan L. Buckalew, Brian Paul Blackman, Chad Michael Hosack, Steven T. Mayer | 2018-11-13 |
| 10106907 | Protecting anodes from passivation in alloy plating systems | Lee Peng Chua, Steven T. Mayer, David W. Porter | 2018-10-23 |
| 10092933 | Methods and apparatuses for cleaning electroplating substrate holders | Santosh Kumar, Bryan L. Buckalew, Steven T. Mayer, Chad Michael Hosack, Robert Rash +2 more | 2018-10-09 |
| 10087545 | Automated cleaning of wafer plating assembly | Steven T. Mayer, Lee Peng Chua, Robert Rash | 2018-10-02 |
| 9899230 | Apparatus for advanced packaging applications | Bryan L. Buckalew, Steven T. Mayer, David W. Porter | 2018-02-20 |
| 9834852 | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating | Steven T. Mayer, Bryan L. Buckalew, Haiying Fu, Hilton Diaz Camilo, Robert Rash +1 more | 2017-12-05 |
| 9828688 | Methods and apparatus for wetting pretreatment for through resist metal plating | Bryan L. Buckalew, Steven T. Mayer, Robert Rash, Brian Paul Blackman, Doug Higley | 2017-11-28 |
| 9746427 | Detection of plating on wafer holding apparatus | Steven T. Mayer, Haiying Fu, Bryan L. Buckalew | 2017-08-29 |
| 9613833 | Methods and apparatus for wetting pretreatment for through resist metal plating | Lee Peng Chua, Bryan L. Buckalew, Brian Paul Blackman, Chad Michael Hosack, Steven T. Mayer | 2017-04-04 |