Issued Patents All Time
Showing 26–42 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9534308 | Protecting anodes from passivation in alloy plating systems | Lee Peng Chua, Steven T. Mayer, David W. Porter | 2017-01-03 |
| 9523155 | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating | Steven T. Mayer, Bryan L. Buckalew, Haiying Fu, Hilton Diaz Camilo, Robert Rash +1 more | 2016-12-20 |
| 9476139 | Cleaning electroplating substrate holders using reverse current deplating | Lee Peng Chua, Steven T. Mayer, Santosh Kumar | 2016-10-25 |
| 9455139 | Methods and apparatus for wetting pretreatment for through resist metal plating | Bryan L. Buckalew, Steven T. Mayer, Robert Rash, Brian Paul Blackman, Doug Higley | 2016-09-27 |
| 9449808 | Apparatus for advanced packaging applications | Bryan L. Buckalew, Steven T. Mayer, David W. Porter | 2016-09-20 |
| 9412713 | Treatment method of electrodeposited copper for wafer-level-packaging process flow | Bryan L. Buckalew, Steven T. Mayer, David W. Porter | 2016-08-09 |
| 9359688 | Apparatuses and methods for controlling PH in electroplating baths | Lee Peng Chua, Mark L. Rea, Steven T. Mayer | 2016-06-07 |
| 9221081 | Automated cleaning of wafer plating assembly | Steven T. Mayer, Lee Peng Chua, Robert Rash | 2015-12-29 |
| 8703615 | Copper electroplating process for uniform across wafer deposition and void free filling on ruthenium coated wafers | John Sukamto, Jonathan D. Reid, Steven T. Mayer, Huanfeng Zhu | 2014-04-22 |
| 8513124 | Copper electroplating process for uniform across wafer deposition and void free filling on semi-noble metal coated wafers | John Sukamto, Jonathan D. Reid, Steven T. Mayer | 2013-08-20 |
| 8500983 | Pulse sequence for plating on thin seed layers | Bryan Pennington, Clifford Raymond Berry, Bryan L. Buckalew, Steven T. Mayer | 2013-08-06 |
| 8308931 | Method and apparatus for electroplating | Jonathan D. Reid, Bryan L. Buckalew, Zhian He, Seyang Park, Seshasayee Varadarajan +4 more | 2012-11-13 |
| 8076241 | Methods for multi-step copper plating on a continuous ruthenium film in recessed features | Frank M. Cerio, Jr., Shigeru Mizuno, Jonathan D. Reid | 2011-12-13 |
| 7964506 | Two step copper electroplating process with anneal for uniform across wafer deposition and void free filling on ruthenium coated wafers | John Sukamto, Jonathan D. Reid, Steve Mayer | 2011-06-21 |
| 7247554 | Method of making integrated circuits using ruthenium and its oxides as a Cu diffusion barrier | Oliver Ming-Ren Chyan | 2007-07-24 |
| 6773571 | Method and apparatus for uniform electroplating of thin metal seeded wafers using multiple segmented virtual anode sources | Steven T. Mayer, Evan E. Patton, Brian Paul Blackman, Jonathan D. Reid, Harold D. Perry | 2004-08-10 |
| 6755954 | Electrochemical treatment of integrated circuit substrates using concentric anodes and variable field shaping elements | Steven T. Mayer, Timothy Cleary, Michael J. Janicki, Edmund Minshall | 2004-06-29 |