Issued Patents All Time
Showing 25 most recent of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10964514 | Electrode for plasma processing chamber | John Daugherty | 2021-03-30 |
| 8883640 | Sequential station tool for wet processing of semiconductor wafers | Theodore Cacouris, Eliot K. Broadbent, Steven T. Mayer | 2014-11-11 |
| 8450210 | Sequential station tool for wet processing of semiconductor wafers | Theodore Cacouris, Eliot K. Broadbent, Steven T. Mayer | 2013-05-28 |
| D672010 | Adjustable chemical vapor deposition showerhead assembly | Percival Verdeflor, Alan Popiolkowski | 2012-12-04 |
| 8048280 | Process for electroplating metals into microscopic recessed features | Steven T. Mayer, Vijay Bhaskaran, Robert Jackson, Jonathan D. Reid | 2011-11-01 |
| 8026174 | Sequential station tool for wet processing of semiconductor wafers | Theodore Cacouris, Eliot K. Broadbent, Steven T. Mayer | 2011-09-27 |
| 7696538 | Sensor for measuring liquid contaminants in a semiconductor wafer fabrication process | Won Lee | 2010-04-13 |
| 7686927 | Methods and apparatus for controlled-angle wafer positioning | Jonathan D. Reid, Steven T. Mayer, Seshasayee Varadarajan, David Craig Smith, Dinesh S. Kalakkad +2 more | 2010-03-30 |
| 7189647 | Sequential station tool for wet processing of semiconductor wafers | Theodore Cacouris, Eliot K. Broadbent, Steven T. Mayer | 2007-03-13 |
| 7097410 | Methods and apparatus for controlled-angle wafer positioning | Jonathan D. Reid, Steven T. Mayer, Seshasayee Varadarajan, David Craig Smith, Dinesh S. Kalakkad +2 more | 2006-08-29 |
| 7084466 | Liquid detection end effector sensor and method of using the same | Won Lee | 2006-08-01 |
| 7033465 | Clamshell apparatus with crystal shielding and in-situ rinse-dry | Jonathan D. Reid, Jeffrey A. Hawkins, Dinesh S. Kalakkad | 2006-04-25 |
| 6964792 | Methods and apparatus for controlling electrolyte flow for uniform plating | Steven T. Mayer, R. Marshall Stowell, Seshasayee Varadarajan | 2005-11-15 |
| 6946065 | Process for electroplating metal into microscopic recessed features | Steven T. Mayer, Vijay Bhaskaran, Robert Jackson, Jonathan D. Reid | 2005-09-20 |
| 6890416 | Copper electroplating method and apparatus | Steven T. Mayer, Robert Jackson, Jonathan D. Reid | 2005-05-10 |
| 6800187 | Clamshell apparatus for electrochemically treating wafers | Jonathan D. Reid, Steven T. Mayer, R. Marshall Stowell, Jeff Hawkins | 2004-10-05 |
| 6773571 | Method and apparatus for uniform electroplating of thin metal seeded wafers using multiple segmented virtual anode sources | Steven T. Mayer, Brian Paul Blackman, Jonathan D. Reid, Thomas A. Ponnuswamy, Harold D. Perry | 2004-08-10 |
| 6755946 | Clamshell apparatus with dynamic uniformity control | Jonathan D. Reid, Jeffrey A. Hawkins, Dinesh S. Kalakkad, Steven T. Mayer | 2004-06-29 |
| 6716334 | Electroplating process chamber and method with pre-wetting and rinsing capability | Jonathan D. Reid, Steven W. Taatjes, Robert J. Contolini | 2004-04-06 |
| 6589401 | Apparatus for electroplating copper onto semiconductor wafer | Wayne Fetters | 2003-07-08 |
| 6551487 | Methods and apparatus for controlled-angle wafer immersion | Jonathan D. Reid, Steven T. Mayer, Seshasayee Varadarajan, David Craig Smith, Dinesh S. Kalakkad +1 more | 2003-04-22 |
| 6527920 | Copper electroplating apparatus | Steven T. Mayer, Robert Jackson, Jonathan D. Reid | 2003-03-04 |
| 6471845 | Method of controlling chemical bath composition in a manufacturing environment | John O. Dukovic, William E. Corbin, Jr., Erick G. Walton, Peter S. Locke, Panayotis Andricacos +2 more | 2002-10-29 |
| 6436249 | Clamshell apparatus for electrochemically treating semiconductor wafers | Wayne Fetters | 2002-08-20 |
| 6402923 | Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping element | Steven T. Mayer, Richard Hill, Alain Harrus, Robert J. Contolini, Steve Taatjes +1 more | 2002-06-11 |