Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10351968 | Front referenced anode | Jingbin Feng, Shantinath Ghongadi, Zhian He, Frederick Dean Wilmot | 2019-07-16 |
| 9677188 | Electrofill vacuum plating cell | Jingbin Feng, David W. Porter | 2017-06-13 |
| 9340893 | Front referenced anode | Jingbin Feng, Shantinath Ghongadi, Zhian He, Frederick Dean Wilmot | 2016-05-17 |
| 9028657 | Front referenced anode | Jingbin Feng, Shantinath Ghongadi, Zhian He, Frederick Dean Wilmot | 2015-05-12 |
| 8470191 | Topography reduction and control by selective accelerator removal | Steven T. Mayer, Mark L. Rea, Richard S. Hill, Avishai Kepten, Eric G. Webb | 2013-06-25 |
| 8415261 | Capping before barrier-removal IC fabrication method | Jonathan D. Reid, Eric G. Webb, Edmund Minshall, Avishai Kepten, Steven T. Mayer | 2013-04-09 |
| 8257781 | Electroless plating-liquid system | Eric G. Webb, Steven T. Mayer, David Mark Dinneen, Edmund Minshall, Christopher M. Bartlett +6 more | 2012-09-04 |
| 8158532 | Topography reduction and control by selective accelerator removal | Steven T. Mayer, Mark L. Rea, Richard S. Hill, Avishai Kepten, Eric G. Webb | 2012-04-17 |
| 8043958 | Capping before barrier-removal IC fabrication method | Jonathan D. Reid, Eric G. Webb, Edmund Minshall, Avishai Kepten, Steven T. Mayer | 2011-10-25 |
| 7811925 | Capping before barrier-removal IC fabrication method | Jonathan D. Reid, Eric G. Webb, Edmund Minshall, Avishai Kepten, Steven T. Mayer | 2010-10-12 |
| 7690324 | Small-volume electroless plating cell | Jingbin Feng, Steven T. Mayer, Daniel Mark Dinneen, Edmund Minshall, Christopher M. Bartlett +6 more | 2010-04-06 |
| 7605082 | Capping before barrier-removal IC fabrication method | Jonathan D. Reid, Eric G. Webb, Edmund Minshall, Avishai Kepten, Steven T. Mayer | 2009-10-20 |
| 6964792 | Methods and apparatus for controlling electrolyte flow for uniform plating | Steven T. Mayer, Evan E. Patton, Seshasayee Varadarajan | 2005-11-15 |
| 6815349 | Electroless copper deposition apparatus | Edmund Minshall, Kevin Biggs, Wayne Fetters | 2004-11-09 |
| 6800187 | Clamshell apparatus for electrochemically treating wafers | Jonathan D. Reid, Steven T. Mayer, Evan E. Patton, Jeff Hawkins | 2004-10-05 |
| 6126382 | Apparatus for aligning substrate to chuck in processing chamber | Martin Scales, David A. Pechin, Jeffrey C. Benzing | 2000-10-03 |