Issued Patents All Time
Showing 1–25 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12392049 | Controlling plating electrolyte concentration on an electrochemical plating apparatus | Zhian He, Shantinath Ghongadi, Quan Ma, Hyungjun Hur, Cian Sweeney +2 more | 2025-08-19 |
| 12157950 | Lipseals and contact elements for semiconductor electroplating apparatuses | Robert Marshall Stowell, Shantinath Ghongadi, Ashwin Ramesh | 2024-12-03 |
| 11859300 | Controlling plating electrolyte concentration on an electrochemical plating apparatus | Zhian He, Shantinath Ghongadi, Quan Ma, Hyungjun Hur, Cian Sweeney +2 more | 2024-01-02 |
| 11512408 | Lipseals and contact elements for semiconductor electroplating apparatuses | Robert Marshall Stowell, Shantinath Ghongadi, Ashwin Ramesh | 2022-11-29 |
| 11401623 | Controlling plating electrolyte concentration on an electrochemical plating apparatus | Zhian He, Shantinath Ghongadi, Quan Ma, Hyungjun Hur, Cian Sweeney +2 more | 2022-08-02 |
| 10969036 | High flow multi-way piston valve for deposition systems | James Isaac Fortner, Robert Rash, Aaron Berke | 2021-04-06 |
| 10927475 | Controlling plating electrolyte concentration on an electrochemical plating apparatus | Zhian He, Shantinath Ghongadi, Quan Ma, Hyungjun Hur, Cian Sweeney +2 more | 2021-02-23 |
| 10711364 | Uniform flow behavior in an electroplating cell | Daniel Mark Dinneen | 2020-07-14 |
| 10435807 | Lipseals and contact elements for semiconductor electroplating apparatuses | Robert Marshall Stowell, Frederick Dean Wilmot | 2019-10-08 |
| 10351968 | Front referenced anode | R. Marshall Stowell, Shantinath Ghongadi, Zhian He, Frederick Dean Wilmot | 2019-07-16 |
| 10053792 | Plating cup with contoured cup bottom | Zhian He, Shantinath Ghongadi, Frederick Dean Wilmot | 2018-08-21 |
| 9988734 | Lipseals and contact elements for semiconductor electroplating apparatuses | Robert Marshall Stowell, Shantinath Ghongadi, Ashwin Ramesh | 2018-06-05 |
| 9945044 | Method for uniform flow behavior in an electroplating cell | Daniel Mark Dinneen | 2018-04-17 |
| 9816194 | Control of electrolyte flow dynamics for uniform electroplating | Zhian He, Jian Zhou, Jonathan D. Reid, Shantinath Ghongadi | 2017-11-14 |
| 9677188 | Electrofill vacuum plating cell | R. Marshall Stowell, David W. Porter | 2017-06-13 |
| 9512538 | Plating cup with contoured cup bottom | Zhian He, Shantinath Ghongadi, Frederick Dean Wilmot | 2016-12-06 |
| 9340893 | Front referenced anode | R. Marshall Stowell, Shantinath Ghongadi, Zhian He, Frederick Dean Wilmot | 2016-05-17 |
| 9309604 | Method and apparatus for electroplating | Steven T. Mayer, Zhian He, Jonathan D. Reid, Seshasayee Varadarajan | 2016-04-12 |
| 9228270 | Lipseals and contact elements for semiconductor electroplating apparatuses | Marshall R. Stowell, Frederick Dean Wilmot | 2016-01-05 |
| 9028657 | Front referenced anode | R. Marshall Stowell, Shantinath Ghongadi, Zhian He, Frederick Dean Wilmot | 2015-05-12 |
| 8540857 | Plating method and apparatus with multiple internally irrigated chambers | Steven T. Mayer, Shantinath Ghongadi, Kousik Ganesan, Zhian He | 2013-09-24 |
| 8475644 | Method and apparatus for electroplating | Steven T. Mayer, Zhian He, Jonathan D. Reid, Seshasayee Varadarajan | 2013-07-02 |
| 8475636 | Method and apparatus for electroplating | Steven T. Mayer, Zhian He, Jonathan D. Reid, Seshasayee Varadarajan | 2013-07-02 |
| 8475637 | Electroplating apparatus with vented electrolyte manifold | Zhian He, Robert Rash, Steven T. Mayer | 2013-07-02 |
| D668211 | Segmented electroplating anode and anode segment | Marshall R. Stowell | 2012-10-02 |