Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10711364 | Uniform flow behavior in an electroplating cell | Jingbin Feng | 2020-07-14 |
| 10669644 | Methods and apparatuses for electroplating and seed layer detection | Steven T. Mayer | 2020-06-02 |
| 10407794 | Methods and apparatuses for electroplating and seed layer detection | Steven T. Mayer | 2019-09-10 |
| 10196753 | Methods and apparatuses for electroplating and seed layer detection | Steven T. Mayer | 2019-02-05 |
| 9945044 | Method for uniform flow behavior in an electroplating cell | Jingbin Feng | 2018-04-17 |
| 9822460 | Methods and apparatuses for electroplating and seed layer detection | Steven T. Mayer | 2017-11-21 |
| 9809898 | Electroplating and post-electrofill systems with integrated process edge imaging and metrology systems | James E. Duncan | 2017-11-07 |
| 7690324 | Small-volume electroless plating cell | Jingbin Feng, Steven T. Mayer, Edmund Minshall, Christopher M. Bartlett, Eric G. Webb +6 more | 2010-04-06 |