Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9447505 | Wet etching methods for copper removal and planarization in semiconductor processing | Steven T. Mayer, David W. Porter | 2016-09-20 |
| 9074286 | Wet etching methods for copper removal and planarization in semiconductor processing | Steven T. Mayer, David W. Porter | 2015-07-07 |
| 8500985 | Photoresist-free metal deposition | Steven T. Mayer, John Drewery | 2013-08-06 |
| 8481432 | Fabrication of semiconductor interconnect structure | Steven T. Mayer, Daniel A. Koos | 2013-07-09 |
| 8470191 | Topography reduction and control by selective accelerator removal | Steven T. Mayer, Mark L. Rea, Richard S. Hill, Avishai Kepten, R. Marshall Stowell | 2013-06-25 |
| 8415261 | Capping before barrier-removal IC fabrication method | Jonathan D. Reid, Edmund Minshall, Avishai Kepten, R. Marshall Stowell, Steven T. Mayer | 2013-04-09 |
| 8372757 | Wet etching methods for copper removal and planarization in semiconductor processing | Steven T. Mayer, David W. Porter | 2013-02-12 |
| 8257781 | Electroless plating-liquid system | Steven T. Mayer, David Mark Dinneen, Edmund Minshall, Christopher M. Bartlett, R. Marshall Stowell +6 more | 2012-09-04 |
| 8197662 | Deposit morphology of electroplated copper | Jonathan D. Reid, Yuichi Takada, Timothy M. Archer | 2012-06-12 |
| 8158532 | Topography reduction and control by selective accelerator removal | Steven T. Mayer, Mark L. Rea, Richard S. Hill, Avishai Kepten, R. Marshall Stowell | 2012-04-17 |
| 8043958 | Capping before barrier-removal IC fabrication method | Jonathan D. Reid, Edmund Minshall, Avishai Kepten, R. Marshall Stowell, Steven T. Mayer | 2011-10-25 |
| 7972970 | Fabrication of semiconductor interconnect structure | Steven T. Mayer, Daniel A. Koos | 2011-07-05 |
| 7947163 | Photoresist-free metal deposition | Steven T. Mayer, John Drewery | 2011-05-24 |
| 7897198 | Electroless layer plating process and apparatus | Heung Lak Park, Jonathan D. Reid, Timothy Cleary | 2011-03-01 |
| 7879218 | Deposit morphology of electroplated copper | Jon Reid, Yuichi Takada, Timothy M. Archer | 2011-02-01 |
| 7811925 | Capping before barrier-removal IC fabrication method | Jonathan D. Reid, Edmund Minshall, Avishai Kepten, R. Marshall Stowell, Steven T. Mayer | 2010-10-12 |
| 7690324 | Small-volume electroless plating cell | Jingbin Feng, Steven T. Mayer, Daniel Mark Dinneen, Edmund Minshall, Christopher M. Bartlett +6 more | 2010-04-06 |
| 7605082 | Capping before barrier-removal IC fabrication method | Jonathan D. Reid, Edmund Minshall, Avishai Kepten, R. Marshall Stowell, Steven T. Mayer | 2009-10-20 |
| 7442267 | Anneal of ruthenium seed layer to improve copper plating | Jonathan D. Reid, Seyang Park, Johanes H. Sukamto | 2008-10-28 |
| 7341946 | Methods for the electrochemical deposition of copper onto a barrier layer of a work piece | Sridhar Karthik Kailasam, John Drewery, Jonathan D. Reid, Johanes H. Sukamto | 2008-03-11 |
| 7232513 | Electroplating bath containing wetting agent for defect reduction | Jonathan D. Reid, John Sukamto, Yuichi Takada | 2007-06-19 |
| 6884335 | Electroplating using DC current interruption and variable rotation rate | Jonathan D. Reid, John Sukamto, Sesha Varadarajan, Margolita M. Pollack, Bryan L. Buckalew +1 more | 2005-04-26 |
| 6664122 | Electroless copper deposition method for preparing copper seed layers | Tatyana N. Andryuschenko, Jonathan D. Reid, Steven T. Mayer | 2003-12-16 |