| 9447505 |
Wet etching methods for copper removal and planarization in semiconductor processing |
Steven T. Mayer, David W. Porter |
2016-09-20 |
| 9074286 |
Wet etching methods for copper removal and planarization in semiconductor processing |
Steven T. Mayer, David W. Porter |
2015-07-07 |
| 8500985 |
Photoresist-free metal deposition |
Steven T. Mayer, John Drewery |
2013-08-06 |
| 8481432 |
Fabrication of semiconductor interconnect structure |
Steven T. Mayer, Daniel A. Koos |
2013-07-09 |
| 8470191 |
Topography reduction and control by selective accelerator removal |
Steven T. Mayer, Mark L. Rea, Richard S. Hill, Avishai Kepten, R. Marshall Stowell |
2013-06-25 |
| 8415261 |
Capping before barrier-removal IC fabrication method |
Jonathan D. Reid, Edmund Minshall, Avishai Kepten, R. Marshall Stowell, Steven T. Mayer |
2013-04-09 |
| 8372757 |
Wet etching methods for copper removal and planarization in semiconductor processing |
Steven T. Mayer, David W. Porter |
2013-02-12 |
| 8257781 |
Electroless plating-liquid system |
Steven T. Mayer, David Mark Dinneen, Edmund Minshall, Christopher M. Bartlett, R. Marshall Stowell +6 more |
2012-09-04 |
| 8197662 |
Deposit morphology of electroplated copper |
Jonathan D. Reid, Yuichi Takada, Timothy M. Archer |
2012-06-12 |
| 8158532 |
Topography reduction and control by selective accelerator removal |
Steven T. Mayer, Mark L. Rea, Richard S. Hill, Avishai Kepten, R. Marshall Stowell |
2012-04-17 |
| 8043958 |
Capping before barrier-removal IC fabrication method |
Jonathan D. Reid, Edmund Minshall, Avishai Kepten, R. Marshall Stowell, Steven T. Mayer |
2011-10-25 |
| 7972970 |
Fabrication of semiconductor interconnect structure |
Steven T. Mayer, Daniel A. Koos |
2011-07-05 |
| 7947163 |
Photoresist-free metal deposition |
Steven T. Mayer, John Drewery |
2011-05-24 |
| 7897198 |
Electroless layer plating process and apparatus |
Heung Lak Park, Jonathan D. Reid, Timothy Cleary |
2011-03-01 |
| 7879218 |
Deposit morphology of electroplated copper |
Jon Reid, Yuichi Takada, Timothy M. Archer |
2011-02-01 |
| 7811925 |
Capping before barrier-removal IC fabrication method |
Jonathan D. Reid, Edmund Minshall, Avishai Kepten, R. Marshall Stowell, Steven T. Mayer |
2010-10-12 |
| 7690324 |
Small-volume electroless plating cell |
Jingbin Feng, Steven T. Mayer, Daniel Mark Dinneen, Edmund Minshall, Christopher M. Bartlett +6 more |
2010-04-06 |
| 7605082 |
Capping before barrier-removal IC fabrication method |
Jonathan D. Reid, Edmund Minshall, Avishai Kepten, R. Marshall Stowell, Steven T. Mayer |
2009-10-20 |
| 7442267 |
Anneal of ruthenium seed layer to improve copper plating |
Jonathan D. Reid, Seyang Park, Johanes H. Sukamto |
2008-10-28 |
| 7341946 |
Methods for the electrochemical deposition of copper onto a barrier layer of a work piece |
Sridhar Karthik Kailasam, John Drewery, Jonathan D. Reid, Johanes H. Sukamto |
2008-03-11 |
| 7232513 |
Electroplating bath containing wetting agent for defect reduction |
Jonathan D. Reid, John Sukamto, Yuichi Takada |
2007-06-19 |
| 6884335 |
Electroplating using DC current interruption and variable rotation rate |
Jonathan D. Reid, John Sukamto, Sesha Varadarajan, Margolita M. Pollack, Bryan L. Buckalew +1 more |
2005-04-26 |
| 6664122 |
Electroless copper deposition method for preparing copper seed layers |
Tatyana N. Andryuschenko, Jonathan D. Reid, Steven T. Mayer |
2003-12-16 |