Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127567 | Systems and methods for suppressing parasitic plasma and reducing within-wafer non-uniformity | Hu Kang, Adrien LaVoie, Shankar Swaminathan, Jun Qian, Chloe Baldasseroni +8 more | 2021-09-21 |
| 10665429 | Systems and methods for suppressing parasitic plasma and reducing within-wafer non-uniformity | Hu Kang, Adrien LaVoie, Shankar Swaminathan, Jun Qian, Chloe Baldasseroni +8 more | 2020-05-26 |
| 9852901 | Systems and methods for reducing backside deposition and mitigating thickness changes at substrate edges | Shankar Swaminathan, Saangrut Sangplung, Frank L. Pasquale, Ted Minshall, Adrien LaVoie +2 more | 2017-12-26 |
| 9793096 | Systems and methods for suppressing parasitic plasma and reducing within-wafer non-uniformity | Hu Kang, Adrien LaVoie, Shankar Swaminathan, Jun Qian, Chloe Baldasseroni +8 more | 2017-10-17 |
| 9460915 | Systems and methods for reducing backside deposition and mitigating thickness changes at substrate edges | Shankar Swaminathan, Saangrut Sangplung, Frank L. Pasquale, Ted Minshall, Adrien LaVoie +2 more | 2016-10-04 |
| 9355886 | Conformal film deposition for gapfill | Shankar Swaminathan, Bart J. van Schravendijk, Adrien LaVoie, Jason D. Park, Michal Danek +1 more | 2016-05-31 |
| 8377824 | Methods and apparatus for depositing copper on tungsten | Jonathan D. Reid, Ugur Emekli | 2013-02-19 |
| 8192806 | Plasma particle extraction process for PECVD | Edward Augustyniak, Jeffrey C. Benzing | 2012-06-05 |
| 8168540 | Methods and apparatus for depositing copper on tungsten | Jonathan D. Reid, Ugur Emekli | 2012-05-01 |
| 7745346 | Method for improving process control and film conformality of PECVD film | Dennis M. Hausmann, James S. Sims, Andrew Antonelli, Bart Van Schravendijk | 2010-06-29 |
| 6884335 | Electroplating using DC current interruption and variable rotation rate | Eric G. Webb, Jonathan D. Reid, John Sukamto, Margolita M. Pollack, Bryan L. Buckalew +1 more | 2005-04-26 |
| 6793796 | Electroplating process for avoiding defects in metal features of integrated circuit devices | Jonathan D. Reid, David Craig Smith, Steven T. Mayer, Jon Henri | 2004-09-21 |