Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9045841 | Control of electrolyte composition in a copper electroplating apparatus | Bryan L. Buckalew, Jonathan D. Reid, Zhian He, Seshasayee Varadarajan, Steven T. Mayer | 2015-06-02 |
| 8703615 | Copper electroplating process for uniform across wafer deposition and void free filling on ruthenium coated wafers | Thomas A. Ponnuswamy, Jonathan D. Reid, Steven T. Mayer, Huanfeng Zhu | 2014-04-22 |
| 8513124 | Copper electroplating process for uniform across wafer deposition and void free filling on semi-noble metal coated wafers | Thomas A. Ponnuswamy, Jonathan D. Reid, Steven T. Mayer | 2013-08-20 |
| 8128791 | Control of electrolyte composition in a copper electroplating apparatus | Bryan L. Buckalew, Jonathan D. Reid, Zhian He, Seshasayee Varadarajan, Steven T. Mayer | 2012-03-06 |
| 7964506 | Two step copper electroplating process with anneal for uniform across wafer deposition and void free filling on ruthenium coated wafers | Thomas A. Ponnuswamy, Jonathan D. Reid, Steve Mayer | 2011-06-21 |
| 7232513 | Electroplating bath containing wetting agent for defect reduction | Eric G. Webb, Jonathan D. Reid, Yuichi Takada | 2007-06-19 |
| 6884335 | Electroplating using DC current interruption and variable rotation rate | Eric G. Webb, Jonathan D. Reid, Sesha Varadarajan, Margolita M. Pollack, Bryan L. Buckalew +1 more | 2005-04-26 |