Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9677190 | Membrane design for reducing defects in electroplating systems | Doyeon KIM, Shantinath Ghongadi, Ludan Huang, Tariq Majid | 2017-06-13 |
| 8197662 | Deposit morphology of electroplated copper | Eric G. Webb, Jonathan D. Reid, Timothy M. Archer | 2012-06-12 |
| 8172992 | Wafer electroplating apparatus for reducing edge defects | Vinay Prabhakar, Bryan L. Buckalew, Kousik Ganesan, Shantinath Ghongadi, Zhian He +4 more | 2012-05-08 |
| 7879218 | Deposit morphology of electroplated copper | Eric G. Webb, Jon Reid, Timothy M. Archer | 2011-02-01 |
| 7232513 | Electroplating bath containing wetting agent for defect reduction | Eric G. Webb, Jonathan D. Reid, John Sukamto | 2007-06-19 |
| 6963815 | Test support program and test support method | Yuzuru Watanabe, Yasuyuki Fujikawa, Kenichi Yamashita | 2005-11-08 |
| 5373495 | Disk playback apparatus | — | 1994-12-13 |