Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8795482 | Selective electrochemical accelerator removal | Steven T. Mayer, Marshall R. Stowell, John Drewery, Richard S. Hill, Avishai Kepten | 2014-08-05 |
| 8268154 | Selective electrochemical accelerator removal | Steven T. Mayer, John Drewery, Richard S. Hill, Avishai Kepten | 2012-09-18 |
| 8197662 | Deposit morphology of electroplated copper | Eric G. Webb, Jonathan D. Reid, Yuichi Takada | 2012-06-12 |
| 7879218 | Deposit morphology of electroplated copper | Eric G. Webb, Jon Reid, Yuichi Takada | 2011-02-01 |
| 7799200 | Selective electrochemical accelerator removal | Steven T. Mayer, John Drewery, Richard S. Hill, Avishai Kepten | 2010-09-21 |
| 7501339 | Methods for making dual-damascene dielectric structures | Jay E. Uglow, Nicolas Bright, Dave Hemker, Kenneth P. MacWilliams, Jeffrey C. Benzing | 2009-03-10 |
| 7482247 | Conformal nanolaminate dielectric deposition and etch bag gap fill process | George D. Papasouliotis, Raihan M. Tarafdar, Ron Rulkins, Dennis M. Hausmann, Jeff Tobin +5 more | 2009-01-27 |
| 7060605 | Methods for making dual-damascene dielectric structures | Jay E. Uglow, Nicolas Bright, Dave Hemker, Kenneth P. MacWilliams, Jeffrey C. Benzing | 2006-06-13 |
| 6909190 | Dual-damascene dielectric structures | Jay E. Uglow, Nicolas Bright, Dave Hemker, Kenneth P. MacWilliams, Jeffrey C. Benzing | 2005-06-21 |
| 6821407 | Anode and anode chamber for copper electroplating | Jonathan D. Reid, Thomas Tan Vu, Seshasayee Varadarajan, Jon Henri, Steven T. Mayer +3 more | 2004-11-23 |
| 6332283 | Indicating mechanism | — | 2001-12-25 |
| 6251770 | Dual-damascene dielectric structures and methods for making the same | Jay E. Uglow, Nicolas Bright, Dave Hemker, Kenneth P. MacWilliams, Jeffrey C. Benzing | 2001-06-26 |